Electronics Forum | Thu Jun 24 11:41:10 EDT 1999 | John Thorup
| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel
Electronics Forum | Wed May 12 20:43:53 EDT 1999 | Earl Moon
| Folks, | I am interested in knowing what level of Nitrogen purity you are running in your reflow ovens for standard SMT assembly? | It seems over the last several years people are increasing the Oxygen level in thier reflow oven atmosphere. | What
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
Electronics Forum | Mon Apr 14 16:21:58 EDT 2008 | ck_the_flip
Bottom-side SMT parts CAN and DO go liquidus during the 2nd reflow cycle. It could be that there was enough variability between the 2 different lot code PCBs to cause the parts to fall off. Remember wetting force determines surface tension (the abi
Electronics Forum | Wed Apr 04 08:57:13 EDT 2001 | Cal
IPC-TM-650 is a works well. Ionic conductivity is a good rule of thumb but I prefer ION Chromatography this will help determine the residues left behind from the fab process. There are a bunch of ways to determine solderabiltiy- Wet Balance and SERA
Electronics Forum | Tue Dec 14 12:00:34 EST 1999 | Kris Wiederhold
We recently reduced our standard aperture reduction to aid in the reduction of solder on gold defects. Since this reduction in aperture size, we have been experiencing exposed copper at the end of the component pads. The heel and toe joints are per
Electronics Forum | Wed Oct 28 17:30:55 EST 1998 | Chrys
| | Can anyone supply me with info on determining the volume of paste left on a pad once reflowed compared to the intial amount put down? Is there a formula or something? | | | That information should be contained in the technical data sheets suppli
Electronics Forum | Mon Dec 10 13:56:51 EST 2001 | slthomas
1) The additional activity of the OA flux probably took care of the oxydation. How do you plan on taking care of the presence of conductive and corrosive residues from it now, though? You're not supposed to wash those parts with water. 2) The tomb
Electronics Forum | Fri Jan 03 10:55:57 EST 2003 | slthomas
I'm not sure what you mean by "standard auto valve stem". Ours use EFD pumps to dispense fluid. I think there used to be a sort of a drip system that attempted to wet the entire length of the paper all at once but have never seen one. Which system
Electronics Forum | Thu Oct 27 08:27:57 EDT 2005 | Adam
Hi We are trying to solder a a contact whose base material is stainless steel, this is then nickel striked with a gold plating of upto 3 microns. We are trying to hand solder this to a standard 1.6 FR4 PCB with a HASL finish. We are seeing problems
