Electronics Forum | Mon Jul 30 21:31:19 EDT 2001 | kennyhktan
Kenny- there are a few standards by IPC and EIA > that address the strength of solder. A pull test > (which is a destructive test) will average 1500 > PSI per joint. > > My concern is that you are > wanting to increase solder volume for an 0805
Electronics Forum | Mon Sep 23 03:12:01 EDT 2002 | surachai
We encounter this problem also , I know that it 's acceptable per IPC standard but sometime it fail at ICT and FCT , then this problem should be prevent , we found it with QFP 16 mil pitch and the defect looklike negative wetting at the front of lead
Electronics Forum | Fri Oct 18 17:47:37 EDT 2002 | russ
What is the determination of poor soldering fails pull test, non-wetting, visual)? I have never heard of an SMT component that has leads higher than the body of the component. Refer to IPC 782 3.6.1.7 it provide the guidelines for SMT standoff heig
Electronics Forum | Tue Oct 22 15:32:09 EDT 2002 | ruppertg125
We are a military contractor and need to build to IPC610 class3. We are receiving many parts with palladium leads and currently use a No-clean solder paste. We have evaluated OA pastes with very little improvements. Without a touch up of all leads th
Electronics Forum | Fri Nov 08 11:37:44 EST 2002 | jonfox
1. Back in the early days of consumer digital cell phones, we ran into the same problem. PCB with 2000 parts in a 5"x2" area, and double sided. We ended up using our standard vacuum tooling for the NIC side and stiff ESD safe foam for the NAC side
Electronics Forum | Thu Mar 06 11:36:37 EST 2003 | O' Connor
Hi, I'm experiencing a problem on a standard part made many times before -Ni/Au finish PCB, Reflow 100% SMD parts. After reflow the gold on the pads does not fully fuse with the solder paste it remains intact on the extremities of the pads, it seems
Electronics Forum | Mon Aug 11 17:48:39 EDT 2003 | Brian W.
Assuming you are working to IPC standards, are you working to Class2 or Class 3? Class 2 has an exception to the 75% barrel fill (para 6.3.1, page 6-7). "As an exception to fill requirements of Table 6-2 on PTHs with thermal planes or conductor
Electronics Forum | Wed Sep 01 20:10:54 EDT 2004 | KEN
The alloy I have chosen uses a wetting angle of 50-70 degrees. Different alloys have different properties. I coupled experimental data with what others have published. Nothing new here. As for reliability...I think you'll be surprised what lead fr
Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying
Electronics Forum | Tue Nov 16 11:11:18 EST 2004 | iva
Hello Charlie, For Application of thermal conductive glue by dispensing, Luxeon recommends Amicon E3503 from Emerson and Cuming (www.emersoncuming.com) for its standard Luxeon Power Light Sources. For optimal thermal connection it is important that
