Electronics Forum | Thu Jul 10 22:44:54 EDT 2008 | davef
Too complicated to answer. Wudda you say that you post pix and we'll tell you what we think?
Electronics Forum | Sat Jul 05 14:07:33 EDT 2008 | shellydhami
Main diffrences in failure modes for mechanically and thermally induced BGA solder joint fracture
Electronics Forum | Fri Nov 18 07:58:59 EST 2022 | zoeluo
What are the IPC standards? They are the most widely recognized acceptability codes in the electronics industry.
Electronics Forum | Mon Nov 28 16:13:59 EST 2022 | markhoch
There are many different IPC Standards, so it depends which process you are referring to. IPC-A-610 is the IPC Standard which pertains specifically to PCB Manufacturing.
Electronics Forum | Wed Jul 20 23:02:44 EDT 2016 | nipun92
We are trainee engineers doing research on the vi technology 5k and 5k 3d AOIs, we would like to know the advancements that they have made in the new 3d 5k AOI, and any setbacks if there are any.
Electronics Forum | Wed Feb 24 16:15:50 EST 1999 | Justin Medernach
Fab Gurus, (Earl) What are the disadvantages of using paper phrenwhatsit as a substrate. I want to justify changing a substrate from paper to chem3 or FR4 and I need some info regarding long term failure issues, etc. Thanks, Justin
Electronics Forum | Mon Apr 13 12:32:55 EDT 2009 | ericthered
That would be great Armando, thanks. Also, what changes might I make with metal clad light boards (LED). heat transference is tricky with these and the solder is not wetting well.
Electronics Forum | Tue Mar 31 11:05:26 EDT 2009 | ericthered
thanks for the responses. Went to Kester. Better now.
Electronics Forum | Fri Apr 03 15:42:23 EDT 2009 | rkevin
Hard to beleive anything from Kester these days would help. (Unsolicited opinion)
Electronics Forum | a1customer |
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