Electronics Forum | Thu Aug 21 05:08:09 EDT 2008 | ihamon
Hi, We had a electric failure on a printed wired board after a few hours of functionning. We determined that the failure was caused by a open circuit in the PCB internal layer near to a via. We performed a microsection but unfortunately, it seemes t
Electronics Forum | Wed Aug 09 19:14:15 EDT 2006 | Board House
Our Manufacturing policy regarding welds is as follows. 1) Inner layers - depends on Core thickness and line width. Our shop will not do any welding on core thickness less then 5 mils. or line width less then 5 mil. Good AOI practices reduce the a
Electronics Forum | Thu Sep 02 21:19:25 EDT 1999 | NAZEEH CHAUDRY
| | Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | | | | Insufficient solderpaste. "No flux" (sat too long after print). | | Those are what I've experienced. | cbga or pbga if pbga check thermal prof
Electronics Forum | Thu Sep 02 12:01:49 EDT 1999 | stefano bolleri
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Are you talking about "primary" process or rework? Are you sure you have not clogged apertures on your stencil? What is the pitch of the balls? My experie
Electronics Forum | Sun Sep 05 12:59:48 EDT 1999 | Dean
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Single sided BGA assy? Or double sided BGA assy (BGA's on both sides)? I have processed double sided (MIrror assy.) bga assemblies and can tell you it is
Electronics Forum | Wed Nov 01 13:44:50 EST 2000 | Thomas Ballhausen
Using convection type reflow we observed following problem: One ball of a 313-PBGA appears to be dewetting. This happens randomly, i.e. no specific ball location, failure rate is rather low (3-4%), but since there are 12 PBGAs on one board the failu
Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
Electronics Forum | Fri Mar 16 10:04:41 EDT 2012 | davef
We'd repair a drop board like this. Here's what our old friend Jeff Ferry said is a published article ... When boards lose their edge: when the corner of a circuit board breaks or is damaged, the problem cannot be ignored by Jeff Ferry One of the m
Electronics Forum | Thu Oct 11 22:25:50 EDT 2001 | davef
Bruce I�m with yall. Designers and fabricators say �pins�. You say: * BGA pins are 1mm [0.039�] pitch. * BGA pads are 0.4mm [0.0157�] diameter. * BGA pins are 0.6 mm [0.024�] side-to-side. * Board thickness is ~0.4 mm [0.015�] First, as you can
Electronics Forum | Fri Jul 23 14:07:52 EDT 1999 | Carl J. Odle
We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after a p
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