Electronics Forum | Tue Jun 10 22:57:18 EDT 2014 | demzvill
Our observation also is that the tape size is too big for the chip which allows the tape to move around. With this i would like to know if there is is a setting in the machine that would slow the feeding rate. We are using juki mounter 2000 series. A
Electronics Forum | Wed Jun 11 11:40:12 EDT 2014 | rgduval
As has been mentioned, it's likely that the component is moving in the tape, and flipping over. It is not likely that the pick/place operation is causing this. What I haven't seen mentioned is that there is an acceptability criteria in IPC for inve
Electronics Forum | Mon Aug 01 18:33:21 EDT 2005 | crishan
Hi All, We are not using a Vib. bowl feeder, or stick feeder, these parts are on a reel. The pick & place machine we are using is a Panasonic brand YV100X, its a single head with 8 nozzles. What we are finding is that the component package size is
Electronics Forum | Wed Sep 26 16:32:40 EDT 2001 | davef
Placing a component the correct side up: * May affect heat dissipation. [Umm, that sounds like stretch, but who knows what designers think about?] * Allows reading the markings on those components that have markings, however cryptic the notation of
Electronics Forum | Thu Jun 12 00:32:23 EDT 2003 | Henry
I would like to ask a question about SMT reflow process. I did 10 pcs samples but all is fail. The sample is double faces to have components (up-side has 4 pcs of BGA and down-side has 3 BGA and 2 QFP). And I saw some of BGA which is tilting in the P
Electronics Forum | Thu Jun 12 03:34:23 EDT 2003 | sanjeevc
I would like to ask a question about SMT reflow > process. I did 10 pcs samples but all is fail. > The sample is double faces to have components > (up-side has 4 pcs of BGA and down-side has 3 BGA > and 2 QFP). And I saw some of BGA which is > t
Electronics Forum | Fri Mar 24 10:26:45 EST 2000 | Russ
Sal, Interesting problem, I have found that W.S. pastes tend to have a shorter tack time in real life than what is advertised. Usually the manufacturers specify tack time as after placement let the board sit and then turn it upside down and see if
Electronics Forum | Wed Oct 20 14:34:29 EDT 2021 | korb23
1 1 I work for a small company as an apprentice. We build mostly mass produce double sided PCBs. We are having trouble keeping the pin headers flat to the PCB through the reflow oven process. The first side is pasted through a printer and populate
Electronics Forum | Tue Sep 18 16:48:55 EDT 2001 | jschake
Why do you think that assembling the BGA, QFP, and fine pitch parts will solve your bridging problem? I would think doing this may cause you more grief by having these more massive components being reflowed upside down fall off during the second pas
Electronics Forum | Thu Apr 15 12:58:59 EDT 1999 | Chrys Shea
| | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | I consider "fines" individual unmelted metal spheres that are foun
.png)
.gif)
