Electronics Forum | Tue May 16 15:53:09 EDT 2006 | Manvendra Verma
What is the solution for removing epoxy on BGA ics?
Electronics Forum | Fri Jun 02 22:46:21 EDT 2006 | mika
Is this the new Xbox 360 You are talking about? So the "modchip" doesn't work? Hmm... Can You please tell us what the purpose of the dissolution of the epoxy on the BGA You would like to do? /
Electronics Forum | Wed Mar 23 08:42:50 EDT 2011 | remullis
I am designing a BGA placement and need to get the via's out away from the part. What is the smallest via diameter I could use?
Electronics Forum | Wed Jun 11 09:35:07 EDT 2008 | grics
Out of curiosity, what is your top side peak temp @ reflow? Have you inspected the boards prior to SMT (at your 5DX machine?) Also, have you tried to run the board through reflow with out any parts or bga placed and inspected? I how long are you in
Electronics Forum | Wed May 21 04:50:51 EDT 2008 | aj
Hi all, We had similar problems a while back. Boards would fail at test but if you applied pressure to the BGA they would pass. Turned out that during the PTH assembly process the Operators were flexing the cards during the insertion of an Oupin C
Electronics Forum | Tue May 20 06:00:33 EDT 2008 | roc2x
Im qualifying a new PCB. I run 2 diff supplier. Supplier A has Zero failure. Supplier B has 4 failure all having Lifted PAD on Bga same location and same location pads that lifted. How can I prove that the PCB have problem? Input : Both run in same o
Electronics Forum | Tue May 20 17:09:13 EDT 2008 | davef
Sorry, we didn't do a good job of understanding your question. For more on delamination, look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=54655 ... but we're not so sure that this is a straight delamination issue, because: * One
Electronics Forum | Tue May 20 08:25:26 EDT 2008 | davef
Well something is different isn't it? * Paste * Part supplier * Board fabrication * Was the profile that you reference the measured temperature or the the settings keyed into the oven? The cross sections seem to show less than expected ball collapse
Electronics Forum | Mon Jun 09 06:37:42 EDT 2008 | roc2x
Hi, After reflow process we do Automatic inspection and after that direct to 5DX machine to check all the solder joints and we detected it at 5DX inspection. This card havent go to any testing.
Electronics Forum | Tue May 20 06:14:32 EDT 2008 | roc2x
Hi, Im qulifiying 2 PCB supplier and supplier A has no defect found but supplier B got 4 defective cards and 4 are same failure. 4 cards having lifted pad after reflow in same BGa location. I run the 2 PCb supplier in one reflow,using same profile,sa
