Electronics Forum | Mon May 30 09:11:15 EDT 2011 | davef
3a ANSI/J-STD-001: * Temperature and Humidity: 18-30°C, 30-70%RH ** If out of range, shall verify electrostatic discharge control program according to ANSI/ESD S20-20 is adequate. ** For process control, more restrictive temperature and humidity lim
Electronics Forum | Thu Jan 12 16:01:40 EST 2006 | Cmiller
The mfg. should be able to tell you. We store ours, for winding transformers, at room temperature. Have had no issues.
Electronics Forum | Sat Dec 10 14:20:32 EST 2005 | adlsmt
I have seen a similar problem once about 15 yrs ago. Someone decided to try a water wash flux for tinning wires. Bad idea! The wires were dipped in the flux, then in a solder pot. As the lead tin's it forces the flux in the strands to move up the wir
Electronics Forum | Wed Dec 07 12:28:37 EST 2005 | PWH
I have seen problems similar to this caused by too high concentration of cleaning solution used in ultra-sonic cleaning process. If cleaning solution is used, make sure it is compatible with solder process. Also, improper mixing of fluxes and solde
Electronics Forum | Thu Dec 08 18:59:04 EST 2005 | KEN
Is this a wire dip tinning process? If yes, then your flux is probably trapped under the insulator, causing corrosion. BAD BAD BAD (hopefully you don't make wire harnesses for air planes or passenger trains). More info please.
Electronics Forum | Wed Dec 07 07:20:02 EST 2005 | davef
We need more information about the situation. For instance: * Describe the green residue * Talk about the distribution of the problem, including a single lot or from various lots and over components and component types on the board * Tell us about t
Electronics Forum | Tue Aug 04 14:29:14 EDT 2020 | dwl
Is the component an LGA or BGA? If its a BGA, it appears like the component is missing balls, if its an LGA, it appears like the solder isn't wetting to the component. What solder are you using? The wetting to the larger pads in the last pic seems
Electronics Forum | Fri Aug 07 03:16:33 EDT 2020 | rsatmech
It's a BGA component. Missing ball is not possible because we have enabled the vision in pick and place. Solder paste is OM353 type 5 Possibilities of Flux dry before reflow seems valid but I saw the board data it was completed on time like other
Electronics Forum | Mon Feb 25 21:13:12 EST 2002 | davef
No, none of us can tell you what is the acceptable level of halide content or contamination in flux residue. The level of harmful residues on your product helps determine the reliability of your product. We know nothing of your product, its custome
Electronics Forum | Mon Feb 28 11:31:08 EST 2005 | russ
This sounds a lot like a profile that is killing flux activity prior to wave immersion. What is your topside preheat temp just prior to hitting the wave? What type of preheat do you have, convection or radiant? Are you using a chip/turbulent wave
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