Electronics Forum | Wed Oct 09 08:44:05 EDT 2002 | apg
Dear colleagues. I ask you to prompt me about necessity of drawing pastes through a stensil at the soldering micro BGA with step between leeds 1 mm and 0,8 mm or uses only a flux for this purpose. And what most suitable paste for the soldering of su
Electronics Forum | Wed Aug 27 00:20:38 EDT 2008 | rameshr
Dear davef, Will u pls advice what are all the possible defects caused while soldering ( assembling ) this type of boards.
Electronics Forum | Sat Apr 10 10:01:43 EDT 1999 | Jeff Price
| | I am looking for a BGA rework/placement system and would like any experience that you have had. I am looking for a system that is reasonable for the placment, removing and re-balling | | | | thank you | | | -I have had wonderful results with
Electronics Forum | Thu Aug 12 17:15:56 EDT 1999 | Jim Blankenhorn
| I am currently involved with designing a pcb which will use 225 pin bga,s | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | use the middle 6 or 7 rows of balls as the ground
Electronics Forum | Fri Aug 13 04:12:41 EDT 1999 | ray hare
| | I am currently involved with designing a pcb which will use 225 pin bga,s | | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | | use the middle 6 or 7 rows of balls as the
Electronics Forum | Thu May 25 09:30:32 EDT 2000 | Roni Haviv
Hi, Can anyone tell me what is the IPC number that deals with the footprint of BGA and micro BGA on the PCB ? Thanks Roni
Electronics Forum | Thu May 25 21:38:06 EDT 2000 | Dave F
Roni: IPC won't help you. There is no standard. Consider your supplier and all your friends at SMTnet as the only things that will allow you to keep hold of that slender thread that you hold while twisting in the breeze. If you didn't have them b
Electronics Forum | Sat Jul 05 14:07:33 EDT 2008 | shellydhami
Main diffrences in failure modes for mechanically and thermally induced BGA solder joint fracture
Electronics Forum | Mon Aug 01 08:38:57 EDT 2005 | kamrant
Joseph, What is the topside temp reading of your board before reaching the pot? Do you have top-heater in your wave machine? It sounds like; you got an insufficient per-heating issue.
Electronics Forum | Mon Nov 08 12:47:52 EST 2004 | clampron
Good Day Everyone, I have a BGA rework that has some chipped/damaged solder mask that will need to be repaired prior to BGA replacement. I was wondering what materials are being used in the industry for this type of application. Any help would be g
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