Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef
First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e
Electronics Forum | Fri Aug 25 04:17:51 EDT 2006 | aj
Thanks for reply, I am mainly concerned when we run a batch of say 200 out of a kit of 400. due to part shortages we might have to revisit the remainder a few weeks later. Its these boards that concern me. we use enig boards. aj...
Electronics Forum | Tue Nov 24 19:07:12 EST 2009 | gregoryyork
I agree Patrick many people blame the assembly fluxes when it is some other hygroscopic chemistry left on the bare PCB such as surfactents from the HASL process these will do exactly what the guy reported in his post fail then cool down and pass ever
Electronics Forum | Tue Jul 06 09:22:52 EDT 2010 | rgduval
Sean, We suggest having the PCB tested for ionic cleanliness. It is conceivable that though the visible flux residue has been cleaned, there is still invisible, yet ionically significant residue in the area of the board/part. We also suggest ensur
Electronics Forum | Tue Sep 10 17:40:14 EDT 2013 | caurbach
Let me start off by saying that although we pot a decent variety of products, we have never been asked to do something like this, so this is not based on personal experience. This is just my gut talking here. I suppose you could use some sort of ca
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Mon Feb 14 12:07:47 EST 2000 | Dave F
Leslie: Product screens and tests of prototypes and test vehicles should be tailored for the specific goal and product. I caution your use of equations and test condition information without specific use environments and design conditions. Lawyer:
Electronics Forum | Sun Aug 13 00:15:58 EDT 2017 | deanm
We manufacture low volume, high reliability assemblies (class 3) that are conformal coated. Up until now we have been cleaning after SMT, then after through hole, then immediately prior to coating with test, formal inspection, etc. between cleaning p
Electronics Forum | Sun Nov 24 10:12:44 EST 2002 | kcorrin
Thanks for your response Dave. I did look at the bare boards after wave solder and they seem to solder fine in that process. I do not see any soldermask bleed on bare boards. Regarding "thin" plating...I have had issues in the past when the board sup
Electronics Forum | Mon Aug 14 15:00:46 EDT 2017 | charliedci
We run a "no clean" soldering process, class II primarily, conformal coating using a Humiseal acrylic coating, applied by machine and by brush. We have seen very few coating issues in my 10+ years from contamination by body oils. We are not using glo
.gif)
.png)