Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf
I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p
Electronics Forum | Tue Oct 06 15:16:39 EDT 2020 | charliedci
More or less, some shrinkage occurs when cool.
Electronics Forum | Tue Oct 06 15:16:30 EDT 2020 | rieko
We are draining a leaded solder pot
Electronics Forum | Tue Oct 06 15:14:54 EDT 2020 | rieko
Thank you Charlie! When the solder is cooled they should slide right out, correct?
Electronics Forum | Fri Oct 09 12:29:12 EDT 2020 | rieko
Can you give me a website for these molds?
Electronics Forum | rieko |
Tue Oct 06 14:23:04 EDT 2020
Electronics Forum | Tue Oct 06 15:01:33 EDT 2020 | charliedci
We've used glass (pyrex, corningware) bread pans in the past, not filling them much over 1" deep. It takes a while but leaves solder ingots sized well to drop back in. Have not tried lead free yet, the higher temp could be an issue using same ty
Electronics Forum | Wed Oct 07 11:38:17 EDT 2020 | rieko
We are draining a leaded solder pot. I'm sure these would work with leaded as well. those look beautiful!
Electronics Forum | Wed Oct 07 13:30:57 EDT 2020 | davef
I have great memories [bad dreams??] of draining solder pots. Previous discussions on SMTnet are worthy of review. Some are here: https://smtnet.com/index.cfm?fuseaction=search_submit&searchstring=bread+pan&collection=site_forum
Electronics Forum | Tue Oct 06 16:14:42 EDT 2020 | rieko
Thank you! Have a great day. I think we will try bread loaf pans and pyrex. Have a great day!:)
