Electronics Forum | Tue Nov 20 09:50:07 EST 2007 | rgduval
Only on the bottom side? Run that side first . We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend
Electronics Forum | Thu Feb 12 16:57:52 EST 2004 | blnorman
Why can't you conformally coat the BGA? We do on some of our lines with no adverse affects.
Electronics Forum | Tue Jul 29 09:28:24 EDT 2003 | russ
Why would you get black pad from rework? I could be wrong but once the pad has accepted solder from the first reflow process wouldn't that eliminate the possibility of a latent finish defect? I am curious. We do perform rework on ENIG all of the tim
Electronics Forum | Wed Jan 13 20:44:42 EST 1999 | Steve Gregory
Hello Sanjay! The cheap deal I use that Earl spoke of is called a SMarT Measure. It's a depth measuring microscope that uses the same principle of measuring optical focus that the units from Vision Engineering do ( if you've ever looked at any
Electronics Forum | Thu Jan 14 15:22:14 EST 1999 | Earl Moon
| Steve, | Whoa, take a breath! That was at least a dollar three-eighty answer. I've got to agree that nothing can replace a qualified, concientious operator for assuring quality. When I too worked at a small shop there in SillyCone Valley, my
Electronics Forum | Thu Jan 14 11:08:29 EST 1999 | Mike McMonagle
Steve, Whoa, take a breath! That was at least a dollar three-eighty answer. I've got to agree that nothing can replace a qualified, concientious operator for assuring quality. When I too worked at a small shop there in SillyCone Valley, my seni
Electronics Forum | Wed Feb 10 18:17:46 EST 1999 | Earl Moon
| Hi, | | Has anyone found any significant differences on profiling using populated and unpopulated boards? Is it worth sacrificing a board to the profile gods? | | Joe | What's the cost of not doing it. In the same breath, why not wait for a sc
Electronics Forum | Tue Sep 25 14:08:59 EDT 2001 | davef
Oooo, the solder on the pad and PGA ball is flowing during reflow down the via to the secondary side? Why didn�t you say so?? ;-) Why would you expect that gravity and capillary action wouldn�t force solder to flow down the solder plated via to the
Electronics Forum | Mon Jan 08 03:47:47 EST 2007 | tk380514
as someone had said before, check you stencil and have it redesigned. I design our stencils for my factory and have inproved quality in BGA , QFP and 0603 case sizes. we did have 1 prototype series that used 0403 chips btu we had brand new feeders an
Electronics Forum | Wed Apr 28 12:18:04 EDT 1999 | Scott McKee
| Hello all, | | I read about Steve's headache a few articles back and I'm really interested by his tip. However, I'm still wondering why square apertures release solder paste better than round ones. For the same volume of paste, the surface area
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