Electronics Forum | Fri Dec 08 11:08:03 EST 2000 | Antonio
Ok fellas, tell me how you'd fix this! I'm having melf connectors that are tombstoning in the wave, NOT the reflow, the wave. I've never seen this before. All other parameters are the same...solder, preheats, placements, the board, building humidi
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Fri Aug 09 11:58:52 EDT 2002 | sam_b
Just started doing BGA rework. After the removal of the "old" component and after site cleaning/component reballing I am ready to install the component on the PCB. It is recommended to apply flux or paste to the board/component. I would appreciate m
Electronics Forum | Wed Feb 03 15:29:33 EST 2016 | sarason
Have you ever done QC type thinking on your problem or are you aware o fthe methodology? Do you run your plant in a clean room environment? Do you clean after reflow? If not Why? What sort of products are you running? What sort of oven are we ta
Electronics Forum | Wed Dec 13 14:15:54 EST 2000 | Chris
I have a product where an IC is soldered using a stencil which puts down way too much paste. The result is massive bridging. Anyway, one of my coworkers claimed he could eliminate the bridging by baking the circuit board in an oven for 5 min at 90
Electronics Forum | Mon Jul 12 11:35:27 EDT 2004 | Pierre RICHARD
Here are some answers to my questions after a good research. I also added more definitions that could help understand this esoteric language used in assembly, specially surrounding fluxes and their use. In blue italics are comments and extracts from
Electronics Forum | Mon Jun 12 22:00:51 EDT 2000 | Dave F
Could be. What are your profiles? 2) Au finish fail => Could be, but that the connections can be made with hand soldering makes this a low probability cause, assuming the activity of the flux used in hand soldering is not significantly different fr
Electronics Forum | Mon Feb 12 11:13:12 EST 2007 | davef
Q1. If I go to the Pb-free solder paste, is it necessary that I have to change my reflow oven OR just by changing with respect to solder paste specification, I can reach my goal? A1. It depends on your current oven. Some ovens can meet the higher t
Electronics Forum | Thu Jun 07 08:55:01 EDT 2007 | grics
Well... Some are worse than others... How can you identify that it is caused by uncured mask and not flux residues? The flux is from indium, 3592. Some research in their tech library revealed that either Kyzen or Zestron would work, which is the re
Electronics Forum | Mon May 31 15:09:56 EDT 1999 | JohnW
| | | | | | | | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processi
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