Electronics Forum | Sat Sep 01 18:14:39 EDT 2001 | Dreamsniper
your glue volume measurement is dictated by your stencil aperture size and thickness when you use stencil printing. Why you need to measure your glue volume deposition? I don't think that this is the right way yet for your undefined problem. What's t
Electronics Forum | Thu Oct 08 07:29:51 EDT 2009 | andrzej
We have 250x340mm panel of PCBs. Stencil for glue would be 0,3mm with about 80 holes mostly for chip components. Our MPM printer at standard set, prints paste on 1 panel at 40-50sec. I need general information if printing glue is faster or slower p
Electronics Forum | Thu Aug 30 21:57:26 EDT 2001 | Franky
I have problem about glue printing measurement ,anybody has process of glue printing . How do you measure? as I know "push test" is the method for testing the strength of connection of component and board but I don't have specification of testing for
Electronics Forum | Fri Oct 05 16:05:58 EDT 2001 | seand
Hello everyone, Your chief variable here is going to be your epoxy. Different materials react accordingly to various inspection methods but, DEPENDING on your print parameters and material, you may be able to utilize an inline inspection machine.
Electronics Forum | Mon May 29 02:15:06 EDT 2000 | Dreamsniper
Hi Buddy, We've tried shifting to this process before and from our point of view here are some of the advantage and disadvantages that we discovered. Advantage 1) Cheap Equipment cost as you just need to use your Solder Paste Printer rather than buy
Electronics Forum | Fri May 26 05:54:40 EDT 2000 | Sal
For the past year now we have been printing adhesive with no real problems. Our printing ranges from 0603's to SOIC using a variation of aperture sizes and metal thickness foils. The crucial parameters are : aperture sizes : These obviously depend o
Electronics Forum | Tue Dec 19 07:53:27 EST 2006 | realchunks
Why? Sounds like a Band-Aid. Are you screen printing of dispensing adhesive?
Electronics Forum | Fri May 25 17:25:25 EDT 2001 | morefun
Is anyone out there is the contract or the OEM sections using viscometers to check solder paste or glue for acurate process definitions. By this I mean check the materials viscosity over a period of time and measure the degradation of performance, t
Electronics Forum | Tue Dec 19 04:04:52 EST 2006 | ec
Hi, I been facing this problem in the past...... Now, I have change to printing. In the past, glue dotting is my bottom neck and need to use 2 glue dotting machine....and now, with printing proces, no more bottom neck in glue process and quality als
Electronics Forum | Wed Sep 20 16:23:13 EDT 2006 | realchunks
Can you change your process to screen printing?
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