Electronics Forum: why ic reverse mount (Page 1 of 3)

Non-wetting: PTH on double-side reflow

Electronics Forum | Wed Apr 06 11:10:47 EDT 2005 | smt_rookie

We process a double-side reflow board (10 ups). Chips and IC's on the bottom side while chips, IC's plus thru-hole connectors and IC sockets on top side (bottom side first then top side reflow). In the past, we were not encountering any soldering pro

Why gold plating on PCB?

Electronics Forum | Fri Feb 28 01:36:43 EST 2020 | crystal12

&gt; What is the use of gold plated boards? <BR> <BR> With the increasing integration of IC, the more IC the more dense. The vertical tin spray process is difficult to flatten the pads, which brings difficulty to the SMT mounting, and

double side reflow soldering

Electronics Forum | Tue May 14 21:07:03 EDT 2002 | ianchan

Hi mates, Yes, the lighter mass is a valid reasoning. in addition to the "lighter (mass) than thou" point of view, 1) the first reason for mounting active Parts (eg. IC, QFP, LGA...) is to minimize the temperature exposure of the Parts to a single

Hall IC Placement (Support with PWB Carrier)

Electronics Forum | Thu Mar 06 09:34:56 EST 2003 | msivigny

Hello Joseph, I'll be honest, I'm finding it a bit difficult to understand and visualize the complete scenario. If this component is designed for surface mount placement into a slot on a PCB, then why does it even need support from the bottom side? I

Re: Pre-heat for Ceramic Capacitors

Electronics Forum | Sat Mar 06 08:01:45 EST 1999 | Scott Cook

| Can someone please advise me to the rework procedure for removal and replacing Ceramic Chip Capacitors (e.g. 0805, 1206, etc.)? | | Is it necessary to pre-heat ceramic capacitors before soldering them onto a PCB with a soldering iron? Is this just

Re: AOI

Electronics Forum | Thu Apr 22 11:04:58 EDT 1999 | Boca

| | I had someone suggest that they weren't really necessary as long as your process is good. Is this just a way to help you keep an eye on your process? | | | | I was thinking, as we set up our line, our money would be more well spent with control

Re: Which SMD placement machines are easiest to use?

Electronics Forum | Thu Jan 27 06:12:14 EST 2000 | Dean

Opeator point of view: 1. eassy to read menues. Organized structure. Large text and use of color to indicate important info status...green=good, yellow= warning, red=fatal etc. Simplicity rules in this realm. GUI are great for operations screens

Re: No-Clean Paste Lab Test Evaluations

Electronics Forum | Sat Feb 14 19:35:51 EST 1998 | C. Lao

Mr Lao We have some specialist knowledge on this subject and offer both equipment and services for these tests. My first recommendation is that take coupons manufactured by your PC Fabricator and then samples at each manufacturing stage: Bare coupon

adhesive on pads

Electronics Forum | Mon Apr 01 20:10:24 EST 2002 | davef

Oh. [Howabout if I smack you?] If ahma connectin� wif whut yer sayin�, you: * Don�t like the appearance of the glue slobberin� out from under the component even though there is no apparent glue on solderable surfaces. * Concerned about the hydrosco

Re: DFM / DFT information

Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F

=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so

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Surface Mount Technology Association (SMTA)
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