Electronics Forum | Wed Dec 09 09:47:32 EST 2009 | dyoungquist
I am curious as to why you need to mix.... We use a 500g cartridge with air gun. Our process is remove the cartridge from the fridge, allow it to warm up to room temperature before inserting into air gun, then apply bead of paste to the stencil. N
Electronics Forum | Fri Jan 28 04:03:51 EST 2011 | grahamcooper22
Print then dispense in the areas you need extra paste. Why can you not use a stencil which has areas etched away around component patterns to thin the stencil down....for example a 150 micron thick stencil etched to 120 or 100 microns in specific are
Electronics Forum | Wed Feb 23 17:24:06 EST 2005 | Austinj
Solder spattering, solder balls, components "popping" off pads........ Not a serious chemical reaction, however, as replied to by KEN on 12/21/04 in a similar article: "Are you adding liquid flux? Or paste "Gel" flux? If liquid flux: This, in my m
Electronics Forum | Tue Dec 21 11:46:29 EST 2004 | KEN
Are you adding liquid flux? Or paste "Gel" flux? If liquid flux: This, in my mind, is an unacceptable technique. Why? 1. Can not control metals content. 2. Probably not adding the same chemestry flux...as paste flux has many different addi
Electronics Forum | Wed Aug 28 10:16:12 EDT 2002 | Jim M.
Sam We install a lot of die in the SMT room using same process as SMT parts.Water soluble solder paste is used for attachment of die to ceramic and boards. Biggest problem i found is the adjustment from installing the die in the bonding area. The t
Electronics Forum | Tue Dec 23 09:13:12 EST 2014 | jeff701
I'm in a manufacturing environment with a very high mix of boards, and some low-mid volume. A "large" production run might consist of 100 boards. Volume: There are numerous boards that have a volume of 1-3 pieces. There are a few boards with an annua
Electronics Forum | Fri Jul 15 14:16:09 EDT 2005 | seaK
We have this problem for a long time. It happens to 3 new Mydata MY-9 machine. When pick and place resistor array 0408 (different value, top and bottom side), the solder paste in the middle two terminals missing occasionally. Thought it's because noz
Electronics Forum | Sun Apr 25 19:03:13 EDT 1999 | Steve Gregory
| Again, I know this does not answer your needs. I do believe there to be a cheaper system than ours that will satisfy your needs. Big Steve found one that seems fairly reasonable for less damandig boards than ours. | | Earl Moon Hi Joe! Yeah Earl
Electronics Forum | Wed Jul 20 14:56:29 EDT 2005 | CLampron
The mount plane is not the same every time. Our machines are conveyorized and the bottom rail is fixed so the mount plane does change with the board thickness. The stand alone table has a V notch for holding the board with the flat edge on the bottom
Electronics Forum | Tue Jul 19 08:12:23 EDT 2005 | davef
We agree with Rob. It looks like either kiss is blowing the paste around. It could be: * Nozzle id too large. * Kiss is occuring after the head has moved from the component. 0408%20MS%2001.jpg - Paste is not missing on the bottom-center pads. It is
winsouce.jpg)