Electronics Forum: why thermal pad voids dpack (Page 1 of 1)

Blow Holes voids in solder fillet on caps

Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef

Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as

SMT voiding

Electronics Forum | Tue Sep 25 15:54:55 EDT 2012 | davef

The more that I chew the idea of outgassing through the pad theory, the less I like it. Why would something, water???, choose to outgass through the pad when moving through the solder mask would be a path of much less resistance? And why wouldn't the

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 14:50:07 EDT 1998 | Dave F

| | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and sol

Re: Immersion Silver PCB Surface Plating

Electronics Forum | Wed Feb 02 20:53:34 EST 2000 | Dave F

Dennis: Several points: 1 If you're talking AlphaLevel process (?): � Good solderability, as HASL, even no-cleans bite well. � Planarity, uniform deposit, no bridgin� of FP. � Doesn't store as well as NiAu ... LT 6 months sealed � Very sensitive t

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 15:27:36 EDT 1998 | Dave F

| | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and s

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 20:18:09 EDT 1998 | Justin Medernach

| | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and

BGA Placement Process

Electronics Forum | Thu Mar 25 09:14:09 EDT 2010 | krish_bala

Hello, I have been having some troubling issues when it has come to BGA Placement and I was hoping if there have been others who have been able to resolve similar issues. We are curently doing reworks on a variety of BGA, but seem to be having issu

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 21:27:33 EDT 1998 | Earl Moon

| | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered a

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Wed May 27 11:19:34 EDT 1998 | Earl Moon

| | | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered

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