Electronics Forum | Wed Mar 07 07:21:08 EST 2007 | jdengler
We window pane the heat sink pad to reduce the amount of paste for DPACK component
Electronics Forum | Fri Mar 09 14:31:56 EST 2007 | stepheniii
That also allows a channel for degassing and also breaks up paste into sections that tend to balance the forces acting on the part. So basically window paning is even better than you might think.
Electronics Forum | Thu Aug 23 15:44:17 EDT 2012 | bandjwet
Anyone have ideas on how to tin window=paned areas of a 4 x 40 gauge ribbon cable? The areas are 2-8 mm in length. Thanks! Bob
Electronics Forum | Mon Dec 06 14:44:41 EST 2021 | dwl
1 to 1 stencil aperture to pad should be fine on the gull leads, and yield 100% coverage with leaded solder. The thermal pad is going to be a challenge though, if you truly need 100% coverage. There will be out gassing from the flux and this will nee
Electronics Forum | Wed Oct 21 10:18:00 EDT 2009 | stepheniii
Make sure the ground pad is reduced on the stencil and window paned. The solder on the thermal pad can lift the part up, especially if it traps gas. 360-380C does sound insane. I would believe a manufacturer saying 360-380F before I could believe
Electronics Forum | Fri Jun 03 15:18:04 EDT 2005 | mmjm_1099
Hello, I was wondering about specs on SMT stencil ordering. I am looking to make some sort of template for aperature layout of some parts. I was wondering some issues that you have all came across or made to change to better suit your boards. For ins
Electronics Forum | Thu Mar 08 04:39:05 EST 2007 | stimpk
Hello, For the most part the ground side width should be reduced, but more than likly you are well into a run of built pcbs? Profiles may or not help in cases of the dreaded DPACK. No issues on any other areas or components so I'd stay away from t
Electronics Forum | Mon Apr 09 13:53:45 EDT 2018 | dleeper
I've never placed one of these before, but it looks like a poorly designed part. It has pads scattered asymmetrically around the body of the part. when it reflows this is going to apply uneven forces to the component, causing it to skew. I guess hav
Electronics Forum | Thu Jan 12 13:21:11 EST 2006 | barryg
Opinions. I have a large finned heatsink that we place over a D2pak transistor. This heatsink is designed to heatsink the transistor through the junction of the pad area that the transistor is attached to. The paste pattern we chose was small dots ar
Electronics Forum | Thu Jun 02 22:40:13 EDT 2016 | slouis2014
Hi, yes have a few experiments initially i tried to increase the solder volume but component pin have insufficient solder. 1. The solder coverage do you calculate it by solder volume or solder area. 2. if i would achieve as you recommend 50-60 % woul
