Electronics Forum | Mon Apr 09 13:53:45 EDT 2018 | dleeper
I've never placed one of these before, but it looks like a poorly designed part. It has pads scattered asymmetrically around the body of the part. when it reflows this is going to apply uneven forces to the component, causing it to skew. I guess hav
Electronics Forum | Wed Apr 18 14:17:48 EDT 2018 | esoderberg
Further divide the ground block into more than 4 panes. Also think about using, assuming you have good placement of using Loctite chip bonder on two opposing corners. Lots of ways to get good results
Electronics Forum | Wed Jul 18 17:09:45 EDT 2018 | slthomas
Update - next run started out horribly so went to another stencil design. Reduced thermal pad coverage by about 40% with 4 panes, with cutouts to avoid the vias. Worked like a charm for 10 boards (90 parts). I think we're finally on to something.
Electronics Forum | Mon Jul 18 10:55:26 EDT 2005 | Sylvain
I have a SO-8 mosfet part from Vishay SI7846DP-T1. Am having a lot of solder ball that coming underneath the part. Am currently using a 5 mils with a window design for my stencil. Those anyone have experience or have any suggestion for an aperture th
Electronics Forum | Thu May 24 12:25:18 EDT 2012 | markbrawley
While buying a used printer may seem like a good value up front, you may be taking risks and making unnecessary compromises that will cost more in the long haul. The perceived cost savings of a used machine may quickly dissolve when you consider som
Electronics Forum | Tue Jan 12 21:42:33 EST 1999 | Jon Medernach
What's important in stencil printing (which differs from screen printing) is providing a consistant volume of paste at each interconnect. The process window varies in proportion to the pitch. More than 60% of all defects are related to solder depos
Electronics Forum | Sat Apr 09 00:37:42 EDT 2016 | smtsparescn
Are you sure it can work even somebody do clone the software and copy to you, Normally it isn't like adding a patch to windows of a pc,
Electronics Forum | Wed Oct 21 10:18:00 EDT 2009 | stepheniii
Make sure the ground pad is reduced on the stencil and window paned. The solder on the thermal pad can lift the part up, especially if it traps gas. 360-380C does sound insane. I would believe a manufacturer saying 360-380F before I could believe
Electronics Forum | Fri Jun 03 15:18:04 EDT 2005 | mmjm_1099
Hello, I was wondering about specs on SMT stencil ordering. I am looking to make some sort of template for aperature layout of some parts. I was wondering some issues that you have all came across or made to change to better suit your boards. For ins
Electronics Forum | Thu Sep 26 14:45:36 EDT 2019 | dwl
Excellent X-ray picture, very helpful! It looks like you have a lot of voiding on the center thermal pad. My guess is that outgassing is pushing solder off the pad which is forming solder balls outside the body of the component package. The first
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