Electronics Forum | Tue Jul 31 06:33:58 EDT 2001 | nifhail
What is the industry standard specification for Resisitivity monitoring at aqueous cleaning? What would be the diff. between specs. for normal PCBA vs PCB that has to go through wire bonding after SMT for COB process. pls advise..thx
Electronics Forum | Tue Nov 30 13:20:07 EST 1999 | John Thorup
Hello Wolfgang Try looking in the process guides section of Circuit Technologies web site. Their recomendation is to bond the jumper wire to the board within 6mm of the lead with hot melt glue, cyanoacrylic glue or adhesive dots. John Thorup
Electronics Forum | Fri Sep 27 10:05:07 EDT 2002 | oconnorp
I spec COB using wire bond attach - 0.75um � 0.25 Gold over 5um � 3 Nickle.
Electronics Forum | Wed Jun 25 08:50:54 EDT 2003 | russ
I believe that Fancort makes some finger protectors that are made of Metal (Aluminum, titanium, etc...) I don't know how well these would process through placement equipment however due to their thickness. Could you clean the Kapton residue off just
Electronics Forum | Wed Jun 25 08:58:02 EDT 2003 | cyber_wolf
I need something that is very thin so I can screen print while the fingers are protected. We have tried cleaning the fingers prior to shipment, but our customer tells us that even alcohol leaves enough residue to cause problems.
Electronics Forum | Thu Jul 03 11:36:57 EDT 2003 | Ron
Have you considered a temporary water washable solder mask. Elvaway solder mask tapes have been protecting Gold Fingers during soldering and simply wash away in a water wash process and leaves no residue.
Electronics Forum | Mon Aug 02 11:21:29 EDT 2004 | sforman1
Use MicroCoat Technologies UV cure solder mask. will leave PCB absolutely clean. used in many PCB solder/wirebonding apps. http://www.m-coat.com
Electronics Forum | Thu Jan 20 09:30:09 EST 2005 | russ
That's what I thought it was. We may very well contract this out. We don't have underfill capability and the volumes may not warrant us investing. Do you know of someone doing this? I don't know at this time if it is the flip chip or the wire
Electronics Forum | Tue Jan 09 21:33:49 EST 2007 | davef
Setup Guy Thanks for the compliment. So, COB is not SMT. What is it? What kind of assembly areas do they use to print, place, reflow, and glob-top [or wire bond / encapsulate] COB? Any information you gave give to clairify this is appreciated.
Electronics Forum | Mon Aug 27 08:03:32 EDT 2007 | davef
Actually, you will be soldering and wire bonding to the palladium layer, so we should have asked if you checked that layer, rather than the nickel. We not sure of the source of the copper that your see on EDX. It's possible copper from the pad migra
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