Electronics Forum | Wed Dec 27 15:07:14 EST 2006 | realchunks
Hi Jack, I've seen around 7 degrees diff in max temp. The real factor here is time to reach peak and time at peak.
Electronics Forum | Wed Oct 20 19:36:45 EDT 1999 | Dennis O'Donnell
Hi Mark: Running a wire under a BGA is possible, however if you plan to mount the BGA over the wire you would want to make sure that the wire insulation will withstand the heat of the reflow temperature. A more reliable way would be to lay a trace
Electronics Forum | Wed Oct 20 16:05:47 EDT 1999 | Mark Charlton
I knew this would happen. Someone wants to rework a bad BGA artwork by cutting a trace and adding a wire under a 292p 1.27mm pitch PBGA. Has anyone done this before? What kind AND size wire do you use? How do you hold it in place during the replc
Electronics Forum | Thu Jul 22 12:05:33 EDT 1999 | John Thorup
| | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) | | |
Electronics Forum | Mon Mar 26 20:04:04 EDT 2007 | Amy
Yes, I have tested some boards, and found that most QFPs which near the via will have the higher temperature. One of my customer requirement is to have the temp less than 200 deg C for top side. We were using the hi temp wire to solder the QFP's for
Electronics Forum | Thu Jul 29 11:58:06 EDT 1999 | Greg Jones
| | | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead e
Electronics Forum | Mon Jul 26 11:20:40 EDT 1999 | Kevin Hussey
| | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) |
Electronics Forum | Fri Nov 27 13:04:47 EST 1998 | Phillip Hunter
| Hi | I have been conducting my first reflow profiles. Most of the texts that I have read suggest soldering the thermocouples to a populated pcb. I am finding this very difficult. I have been using a high melting point (Sn5 / Pb95) solder and the
Electronics Forum | Tue May 18 16:48:49 EDT 1999 | Tony
| | | | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard mi
Electronics Forum | Wed Dec 17 03:26:17 EST 2003 | Kev
Hi Lads, Thanks for all of the replies. To answer a few of your questions..... My wave is a Hollis PT500N. It has 3 zones of pre-heater rod elements. Each individual element (601195-01) is 500 watts. There are 16 elements per zone so 8 Kw per zone.
