Electronics Forum | Wed Apr 06 08:27:12 EDT 2011 | kaschliman
Our two component suppliers use 99.5Sn/0.5Cu and 97Sn/3Ag solder (respectively) for tinning their leads. We use 98.9Sn/.66Cu/.33Ag solder in our wave solder machine. Is there any significant advantage to either tinning process regarding solderabili
Electronics Forum | Mon Mar 02 13:06:36 EST 2020 | charliedci
If you add any "flux cored" wire solder to the pot make sure you have ventilation as the flux will burn off and smoke like crazy. This solder pot is like any used in a wave or selective solder, no flux. The flux is added to wire prior to di
Electronics Forum | Wed Mar 11 19:22:02 EDT 2020 | victorzubashev
Hi, 1. do not use flux-cored wire- the smell is bad and flux will evaporate anyway at the time of solder wire melting. 2. as suggested use solder bars, something like this: https://smtnet.com/company/index.cfm?fuseaction=view_company&company_id=39635
Electronics Forum | Sun Sep 23 18:59:59 EDT 2007 | darby
I presume you are looking at low melting point solders. Firstly, I would consider running BOTH sides with the same paste - this will cut down the opportunities for a mix up with rework or retro-fit. Secondly, check that there is a cored wire availabl
Electronics Forum | Mon Jul 16 10:51:09 EDT 2007 | patrickbruneel
D. Hillman, et al., �The Impact of Reflowing a Pb free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity,� International Conference on Lead-free Soldering, CMAP, Toronto, Ontario, Canada, May 24-26, 2005, http://www.
Electronics Forum | Wed Jul 27 15:54:44 EDT 2005 | Hiram
Hi everybody, We have wave solder fixtures made of Durapol and multiple wave solder machines. Most likely we�ll use the same pallets for either tin-lead or lead-free solder for a while (of course after washing the pallets). Should we test the palle
Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack
Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal
Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef
What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC
Electronics Forum | Sat Apr 14 09:28:58 EDT 2007 | davef
When soldering a component to a board, the solderability protection on the component combines with the solderability protection on the board and the solder to form an alloy. This alloy is unique for that combination of solder and solderability protec
Electronics Forum | Thu Oct 05 07:23:34 EDT 2006 | Chris
Hi all experts, I have no background about PCB or SMT process. I am now encountering some issues after SMT - Unstable stitch bonding condition. I am now suspecting some contaminants remain on lead after cleaning. Therefore, how can I check th
.gif)
.gif)
