Electronics Forum: wire pull test for black pad (Page 1 of 3)

ENIG (thru hole ring turns black after wave soldering)

Electronics Forum | Tue Aug 02 15:03:37 EDT 2016 | davef

On a previous black pad experience we soldered a wire to a fiducial and did a pull test to failure. On the black pad board the wire and solder pulled of clean leaving the fiducial on the board. On good boards the copper came off with the wire. If you

Plating for aluminum wire bonding

Electronics Forum | Tue May 13 21:08:24 EDT 2003 | ramanandkini

Dear Sir, Sorry for the delay in reply. This is regarding MIL standard for bond pull strength: MIL-STD-883C dt.25/08/83 Bond strength (destructive bond pull test); refer table-1 Minimum bond strengths for various wire composition & diameter given.

BGA Pull test

Electronics Forum | Mon Oct 25 17:50:46 EDT 2004 | Mike

I work for a PCB Manufacture and I am looking for info on BGA Pull test or strenght test. I have a CM that is experiencing bga's with some weak joints. they are telling me that when they do their pull test the joints are breaking at the nickel inste

BGA Pull test

Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef

First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e

Black pad defect on gold plated boards

Electronics Forum | Thu Aug 21 17:17:47 EDT 2003 | justin

Do some push / pull testing. Typically with black pad, you can flick the components right off the board. If you have this, the boards are about as reliable as a Yugo. If you get decent push / pull results, odds are you don't have black pad and you

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R

COB setting for Electrolytic & Electroless Gold

Electronics Forum | Fri Oct 22 10:41:08 EDT 2010 | janz

hi 1) just run test batch and pull test wire. Use MIL std to find out your results. 2) again run through and test wire.

Books for SMT

Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef

DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b

Re: Desperately looking for help

Electronics Forum | Wed Dec 13 11:24:08 EST 2000 | Wolfgang Busko

Hi George, bad luck! That�s why we professionals get so much money for it. Those "thingies" are mainly capacitors or resistors. If a capacitor is missing you might with luck not even notice it. A resistor, that�s different, you will notice it, what

Re: Desperately looking for help

Electronics Forum | Wed Dec 13 11:24:10 EST 2000 | Wolfgang Busko

Hi George, bad luck! That�s why we professionals get so much money for it. Those "thingies" are mainly capacitors or resistors. If a capacitor is missing you might with luck not even notice it. A resistor, that�s different, you will notice it, what

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