Electronics Forum | Thu Nov 14 10:18:31 EST 2019 | slthomas
It doesn't look to me like the jumper wire is wetting at all. I would immediately question the solderability - do you know how that jumper wire is finished (plating type)? Also, how experienced are the solderers? It could be that the wire never get
Electronics Forum | Sat Nov 23 06:05:31 EST 2019 | hemantpang23
Hello Everybody, I have a problem with a DEK 265GSX, I get this error message: Vision hardware error Controlled lighting not responding FATAL ERROR - REINITIALISE MACHINE I have found that this might be due to a broken wire and I have checked all
Electronics Forum | Wed Oct 20 19:36:45 EDT 1999 | Dennis O'Donnell
Hi Mark: Running a wire under a BGA is possible, however if you plan to mount the BGA over the wire you would want to make sure that the wire insulation will withstand the heat of the reflow temperature. A more reliable way would be to lay a trace
Electronics Forum | Thu Nov 26 03:59:50 EST 1998 | Chi-Ting Chen
I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cause
Electronics Forum | Thu Nov 26 06:07:40 EST 1998 | Earl Moon
| I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cau
Electronics Forum | Wed Sep 23 11:50:34 EDT 1998 | Jeff Ferry
| Can anybody point me to a Standard that provides details on the use of Wire Links for the repair of SMT PCBs, e.g. the maximum number of permissible links, the material to be used, the method of joint etc.? At the next meeting of the IPC Repair com
Electronics Forum | Tue Oct 02 12:56:41 EDT 2001 | Scott B
We have come across this where the operator was using thin gauge solder wire (more suited to fine pitch SMT soldering) to form large solder fillets (power connections or sheild cans). We found that the operator was feeding large amounts of solder wir
Electronics Forum | Mon Mar 07 21:37:42 EST 2005 | ABHI
It depends on your product requirements. I have seen aluminium wire bonding operations in as high as class 100K clean rooms. These are the assembly areas for calculators. The best is class 10K clean room for wire bonding. You can go upto fine pitch w
Electronics Forum | Wed Dec 28 21:18:12 EST 2005 | davef
You don't TS bond gold wire to nickel [of ENIG] for the same reason that you don't TS bond gold wire to hard gold. [Nickel or maybe cobalt is used to harden soft gold.] Together nickel and gold produce unreliable bonds. Look here: * http://www.smta.
Electronics Forum | Sat Feb 11 18:33:36 EST 2006 | KEN
One factor everyone overlooks is that furnace and external T/C wires are (generally) not calibrated. Unless you are sending your wires to a lab for NIST characterization your T/C wires are NOT calibrated. They (new wires)operate within a specifie
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