Electronics Forum | Fri Jun 29 09:58:35 EDT 2001 | edmentzer
We use 30 and 32 gauge PTFE wire. The insulation will not melt with normal hand soldering temps. The wire was made by Thermax/CDT. Their phone number is 800-423-5873. The only problem with the wire is that is hard to glue to the board. We use Ta
Electronics Forum | Thu Sep 04 16:43:00 EDT 2003 | coeps
I have never used Manganin wire. I understand it is difficult to solder. Should we use a move active flux. It will be a .25mm, PTFE insulated manganin wire spliced to thermistor wires. Thanks coeps
Electronics Forum | Thu Jan 23 23:00:42 EST 2014 | davef
I agree with AFlex. Don't tin stranded wire that's assembled into a screw terminal block. I believe the reasoning has to do with avoiding stress on the wire metal caused by different expansion rates of the solder and the wire. BR davef
Electronics Forum | Fri Nov 27 02:09:50 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Fri Nov 27 02:11:17 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Mon Jun 19 08:45:55 EDT 2006 | dougs
Hi All, We have a board that's going through our process at the moment, it's 1.6mm thick and has 4 wires soldered into it, these are 10SWG multi stranded wires, i'm finding that it's difficult to get the holes filled with solder as it travels up
Electronics Forum | Mon Aug 27 12:42:47 EDT 2007 | rgduval
I know this is a little outside of SMT production, but, I'm hoping someone out there can help me with a small issue. I have a product that I'm building that requires 4 .250" wires, with .125" strip on each end. I solder one end to the board, and on
Electronics Forum | Wed Dec 14 12:34:56 EST 2016 | cy4223111
Hi all, Recently, we are trying to do wire bonding between a 75 * 75 um pad on a chip and substrate with 150 um height difference, but when completing wire bonding and the wire bonds on pad and substrate, the pad will get out of the chip easily
Electronics Forum | Fri Dec 16 13:37:52 EST 2016 | edhare
Hi all, > > Recently, we are trying to do > wire bonding between a 75 * 75 um pad on a chip > and substrate with 150 um height difference, but > when completing wire bonding and the wire bonds > on pad and substrate, the pad will get out of
Electronics Forum | Wed May 18 07:22:06 EDT 2005 | davef
Wire bonds don't stick when bonded * Check pull and shear strength. * Depending on point of failure, review parameters. * Listen during bonding, if there is a high pitch buzz, there is vibration in the system somewhere, "seek and destroy". * Get the
