Electronics Forum | Tue Mar 16 18:11:54 EDT 2021 | grahamcooper22
I am wondering, I have an application for assembling a 0.4mm WLCSP to a pcb....the solder sphere size is 0.26mm...would you print paste in the normal printing process and then place the device and reflow...or would you use a fluxing station on the pi
Electronics Forum | Wed Aug 07 22:20:59 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John H. Lau; McGraw-Hill Professional Publishing; ISBN: 0071351418; 1st edition (February 8, 2000)
Electronics Forum | Tue Nov 17 17:05:50 EST 2015 | davef
Look here: http://www.topline.tv/Pitch.html We receive no benefit from posting the link above.
Electronics Forum | Tue Nov 17 19:27:53 EST 2015 | billthebuilder
Thanks for your response. I have already been trading emails with them but their minimum order quantity is too high for me unfortunately.
Electronics Forum | Wed Nov 18 12:56:40 EST 2015 | dyoungquist
Try http://www.practicalcomponents.com/ They have lots of dummy parts and may have what you need.
Electronics Forum | Wed Mar 17 17:11:10 EDT 2021 | emeto
I would recommend flux approach. I have placed tons of these packages. They have plenty of paste on the balls, and tend to short easy when you screen paste. Even if you get the print right, you would still see more voiding compared to using just flux
Electronics Forum | Wed Mar 17 20:06:37 EDT 2021 | grahamcooper22
Hello Evtimov, thank you for your reply. I agree with you, using gel flux should be best. Did you use flux dipping station on a pick and place machine, or do it manually ?
Electronics Forum | Thu Jun 02 14:23:36 EDT 2022 | SMTA-64387182
We are designing a new PCB that will include a 0.4 mm WLCSP IC package. The OEM’s application-note for this package states ENIG; Au
Electronics Forum | Tue Jan 07 17:58:11 EST 2003 | davef
The following book has several chapters on various [ie, flow, no-flow, etc] underfils that could help you: Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John H. Lau; McGraw-Hill Professional; ISBN: 0071351418; 1st edition; 200
Electronics Forum | Mon Nov 16 20:22:52 EST 2015 | billthebuilder
I need one for testing a PnP machine. It's very hard to hunt something down just by package, so does anyone know of anything with a 0.3mm pitch? BGA preferred. Or clues where to look? Thanks!
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