Electronics Forum | Wed Oct 26 14:20:41 EDT 2005 | TPM
Brian, We have the Mirtec Table Top. It is very good at detecting the component and orientation. It is however only as good as we program it to be. We have seen some limitations in respect to solder connections. I have not found it to be 100% re
Electronics Forum | Wed Sep 08 20:48:28 EDT 2004 | Darby
Yes I agree with Russ about someone asking up front and everything else. Two tips. 1. Keep the marks at least 5mm in from the conveyor edges of the pcb so that clamping systems do not hide the mark. 2. Make sure the marks are eccentric around the pcb
Electronics Forum | Tue Aug 22 08:15:34 EDT 2000 | Mark
I have a customer that has a wrong pin out on a TSOP32. The Raw PCB is expensive, "time to market concerns", and respin lead times are forcing an alternative solution. He would like to design a "conversion" daughter board with the correct pin out to
Electronics Forum | Wed Sep 08 13:09:40 EDT 1999 | Joe Wayt
Hello: We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into the oven. When the
Electronics Forum | Thu Jun 14 02:00:01 EDT 2001 | ianchan
Hi mate, AOI seems great for : 1) missing 2) wrong parts 3) wrong orientation 4) x-y axis misalignment 5) upside down placement 6) etc.....? AOI shucks for : 7) unsolder (joint) defect 8) tombstone / tilt My guys are evaluating AOI m/c, for substi
Electronics Forum | Fri Jul 29 13:30:43 EDT 2016 | gregp
Versatec specializes in the remanufacture of Contact Systems machines, most notably the CS-400E component locator with programmable cut and clinch. these machines are field proven over the past two decades and provide many benefits when utilized: 1.
Electronics Forum | Wed Aug 19 01:00:13 EDT 2009 | sergey2007
Hi! Thanks to everyone! Josh, I don't think it could be something wrong with the mechanics, as just one component was rotated. Anyway, we will check the mechanical parts of the oven. LarryD, thank you for the advice. But what is the physics of the
Electronics Forum | Wed Apr 06 11:10:47 EDT 2005 | smt_rookie
We process a double-side reflow board (10 ups). Chips and IC's on the bottom side while chips, IC's plus thru-hole connectors and IC sockets on top side (bottom side first then top side reflow). In the past, we were not encountering any soldering pro
Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc
In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is
Electronics Forum | Mon Jul 03 05:39:05 EDT 2006 | ronalds
Hi, I am experience problems while testing wave soldering SMT components that are glued on the solderside (lead free). Between de leads of SOx type IC's and SOT's develop a great deal of solder beads. I have been using a RSS temp.profile while spr
