Electronics Forum | Mon Jul 03 05:39:05 EDT 2006 | ronalds
Hi, I am experience problems while testing wave soldering SMT components that are glued on the solderside (lead free). Between de leads of SOx type IC's and SOT's develop a great deal of solder beads. I have been using a RSS temp.profile while spr
Electronics Forum | Thu Dec 16 15:06:32 EST 2010 | rway
I would go with AOI. Reasons are: --AOIs are faster --They have more coverage. Given, you cannot test the value of components, but the AOI will ensure that all resistors are correct, orientation of ICs are proper and components are present on the
Electronics Forum | Thu Feb 27 11:46:47 EST 2003 | genny
We have struggled with this as well. Basically, we have a consistent rotation for all packages of the same type, but I don't think our rotation has anything to do with the actual rotation that the PnP equipment actually wants to see. I believe our
Electronics Forum | Thu Oct 28 23:45:23 EDT 1999 | DGrenier
JC: Seen this before, many times. We fixed our problems at the co I work for by giving a packaging specification to our purchasing dept. Took some work but the payoff was pretty big. This document includes such things as orientation,pitch,tape type
Electronics Forum | Fri Apr 23 12:10:41 EDT 1999 | Dave F
| A customer told me that pad geometry was to be different depending on soldering process. | | I think this is untrue. What is stated in the IPC - SM -782 standards is that parts should be placed to elimanate a trailing edge. This however should
Electronics Forum | Sun Nov 12 17:35:40 EST 2000 | Darby
George, You need to calibrate your chucking assemblies! . What you are seeing is poor alignment due to egocentricity in you jawing assemblies. Also make sure that your jaws/nozzles are in good condition and that your assemblies are correctly orientat
Electronics Forum | Tue Jun 10 20:31:55 EDT 2003 | iman
In a perfect world, the machines would be maint."guys" for the automation machines. Think "closed loop" system. Anyway, getting back to our reality job, we are still game for automation to improve thru'put, quality, reduce problems. The focus here
Electronics Forum | Tue May 23 14:08:56 EDT 2006 | bman
We've been placing BGAs for a while now, and I personally had to x-ray every one of them. The only time we had a placement problem was when a few parts were placed by machine in the wrong orientation. The operators fixed it by hand before it went t
Electronics Forum | Sun Jul 23 18:04:51 EDT 2006 | mika
4. There is a possibility that your company have more than one vendor for a specific component (same partnumber for you but different mfg. part nr). Let say that it is a red led and this itself could be somewhat tricky to order: Red led is as most of
Electronics Forum | Mon Nov 13 08:24:03 EST 2000 | G. English
Richard, From your description of the IC, as Wolfgang indicates it sounds like a 20mil pitch device, the aperture design really depends upon your solder paste particle size, we use a type 3 solder paste with a mesh size of �325 / +500microns. This is
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