Electronics Forum | Mon Jan 21 16:13:50 EST 2008 | arun2382
We see delamination at Mold compound to substrate interface when tested for MSL3. We haven't tested the substrate for cleanliness. Can you please suggest methods for this? thanks, arun
Electronics Forum | Mon Feb 04 07:43:02 EST 2008 | davef
Bruce: We know Arun is not cleaning the board properly. Arun does not know how to determine if the board is clean. Arun doesn't know how long to clean the board. Apparently, you do. Tell Arun the answers.
Electronics Forum | Mon Jan 21 11:12:20 EST 2008 | davef
Just what is delaminationg during testing? Water washing should be sufficient to clean WS609. On the other hand, it's possible you're conveyor speed is too high to do a good job cleaning the high density areas. What kind of testing have you done to
Electronics Forum | Tue Jan 29 13:51:24 EST 2008 | bbarton
Dave F....BOGUS BOGUS BOGUS What compatability issue could there possibly be if the flux is removed during wash???? Why on EARTH would you leave ANY WS flux residue on the board? A recipie for disaster! Beef up the cleaning process, test for contami
Electronics Forum | Fri Jan 18 18:19:38 EST 2008 | arun2382
Is normal DI rinse cycle enough to wash away all residue after SMT assembly of high density substrate? This substrate would later be over molded to form MCM module package and I am seeing delamination in high density areas of the substrate at MSL3
Electronics Forum | Sun Feb 03 16:50:59 EST 2008 | bbarton
Won't argure with you Davef, but guys who suggest totally unnecessary steps to resolve a cleaning problem drive me NUTS!! What would the moulding compound manufacturer have to do with it? HIS BOARD IS NOT CLEAN!! Keep it simple, get the job done! Don
Electronics Forum | Tue Jan 29 19:47:36 EST 2008 | davef
Bruce Barton: We're not intending to suggest that anyone is purposely leaving WS flux residue on the board after cleaning. Fact is, Arun isn't sure if the boards are completely clean. Arun said, "We haven't tested the substrate for cleanliness." Gi
Electronics Forum | Mon Jan 21 19:22:38 EST 2008 | davef
In your situation, the issue is the compatibility of your flux residues and the encapsulant that you choose. First, contact your encapsulant supplier for advice. They've likely been down this road with other customers and may be able so save you som
Electronics Forum | Thu Jul 02 10:31:35 EDT 2009 | toddl
We use Kester 2331 w/s flux in ours.
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
