Electronics Forum: x-ray smd counter (Page 4 of 5)

Re: Who Are The X-Men?

Electronics Forum | Thu Oct 15 17:20:25 EDT 1998 | Justin Medernach

| | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | Q: Can you get away with sp

Re: No Free Beer But...

Electronics Forum | Fri Oct 16 17:01:21 EDT 1998 | Justin Medernach

| | | | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | | | Q: Can you get

Re: No Free Beer But...

Electronics Forum | Mon Oct 19 14:24:06 EDT 1998 | Justin Medernach

| | | | | | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | | | | | Q:

SMD Counters

Electronics Forum | Fri Feb 25 15:37:01 EST 2011 | cbeneat

Manncorp makes a motorized version which we use, I believe the model is Toppoint. Has never had an issue, not sure if the price is competitive, but works well.

Re: BGA problem: open after reflow

Electronics Forum | Mon Nov 06 21:06:13 EST 2000 | Dave F

Thomas: Wheeee, a 40% failure rate. Now, that make your boss chase you around the room won�t it? As you indicated, x-ray won�t do dip about helping to identifying problems [or ball cracks either]. Consider using an ERSA scope [er whatever they ca

VTEK Versacount II

Electronics Forum | Mon Aug 14 08:23:56 EDT 2006 | RLM

I would like to bring a Vtek Versacount II SMD counter on line but it is missing the tape guide. Can anyone give me some dimensions so I can have a new one fabricated. VTEK has been no help at all. I am mostly interested in the tape guide groove. I n

Voids in SMD reflowed solder joints

Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan

Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids

SMT Assembly Line

Electronics Forum | Mon May 29 04:02:51 EDT 2006 | vasily

Hi Efren Unfortunately I cannot say about prices, because I don't know them in your region. But I can offer you to consider the world-leader manufacturers of each type of equipment. I think you can obtain all information through their web-sites. We s

Re: Curing of Glue for SMT Components

Electronics Forum | Thu Jun 15 22:06:15 EDT 2000 | Dreamsniper

Hi Raeto, 1. You do not have reflow oven. This means that you are not running Surface Mount Technology in your shop floor...am I correct? Why do you plan to have SMD's under your PCB's ? Can't you replace them with their PTH counter part and have th

Re: Void in solder bump

Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.

| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard


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