Electronics Forum | Fri Apr 13 12:37:35 EDT 2001 | edylc
>>> gold finger was covered by a Kapton tape and it was done offline away from the Screen printer or rather from the SMT lines itself, we are using an ENIG Pcb's , the process doesnt need a wave soldering ....however at the final end of the line ,
Electronics Forum | Fri Apr 13 22:38:19 EDT 2001 | edylc
Hi , Could you be seeing the nickel under the gold plating because you are removing some of the Gold with the Kapton Tape....?? You mean , the adhesive properties of the kapton tape will cause the gold plating on the gold finger to be somehow peel of
Electronics Forum | Tue Jan 15 10:59:11 EST 2008 | gregoryyork
We did numerous testing some years ago on matte, gloss and semigloss and found after chemical extraction of the PCB and IR analysis the only difference was the actual cure of the resist. The more plasticizers released the worse the balling If you use
Electronics Forum | Wed Jan 12 13:42:19 EST 2011 | dwonch
Hi All, I'm hoping there is a PCB expert or two hanging around. We're having some solderability issue on our boards. The finish is ENIG but it doesn't seem to be related to the finish process itself. We did SEM and EDX analysis and found aluminum an
Electronics Forum | Sat Jan 19 02:25:37 EST 2002 | ianchan
Hi, Have a board run, using 63/37 Water Souble (WS) process. during the reflow setup time, we had unsolder issues on a leadless bump chip carrier (BCC) IC level package. To rectify the unsolder rejects, we adjusted the reflow time from 25-55sec into
Electronics Forum | Wed Jan 30 14:11:15 EST 2008 | slthomas
We dodged it for a while but it was inevitable. Here's the question. What do I REALLY need, and does anyone even agree on it? OK, that's *two* questions. The first board we're likely to do has three parts that will need special consideration. One
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