Electronics Forum | Mon Jun 14 09:16:58 EDT 1999 | Adam Pratt
| | | | | Hello all! | | | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We d
Electronics Forum | Fri Feb 25 04:46:36 EST 2000 | Jeff Sanchez
Hey Travis, Thanks for the response. I did find a simple profile to use. As you said it took alot of trial and error. I was just looking for a good place to start. As for questioning the capability of a batch reflow oven,they have good reviews f
Electronics Forum | Fri Feb 25 04:46:36 EST 2000 | Jeff Sanchez
Hey Travis, Thanks for the response. I did find a simple profile to use. As you said it took alot of trial and error. I was just looking for a good place to start. As for questioning the capability of a batch reflow oven,they have good reviews f
Electronics Forum | Fri Feb 06 15:52:18 EST 2004 | pjc
SPM is superior in terms of technology and application. SPM has larger print area, up to 20� x 19", vs. 17.7� x 15.7� for the MicroFlex. MicroFlex is microprocessor controlled while the SPM has a PC. SPM can print down to 12mil (0.3mm) fine pitch no
Electronics Forum | Mon Apr 12 09:36:57 EDT 2004 | wgaffubar
Russ, These are the pb free components that you mentioned that are coming around the bend. Not the old CBGA's. I use to use CBGA's alot with former company. These are 15 x 15 mm plastic BGA's with 14 mil pg free solder balls going on 8 mil gold pads.
Electronics Forum | Thu Jun 19 21:39:31 EDT 2008 | mika
Hi, we used to have a RoHS package with uBGA 380 Solder ball's 0.8 mm pitch approx 15x15 mm, bump size is 0.4mm on a 0.33mm pad. Suddenly we need to use another vendor for various reasons. However, the new bump size is 0.45mm according to specs and t
Electronics Forum | Tue Aug 24 07:09:16 EDT 1999 | Brian
| | This is out of the normal scope of this site but� | | | | I am in search of a Digital Camera for use with documentation instructions. What would be the Minimum Resolution that I should require? I will need details of assemblies such as Compone
Electronics Forum | Thu Mar 05 13:17:19 EST 1998 | Justin Medernach
| Hello everyone! | Does any know anything about bare board size variations? | Is there a spec. or tolerance? | I'm running small lots of boards and during the screen printing process | I find that I cannot paste each board perfectly.I've tried other
Electronics Forum | Thu Mar 05 23:33:53 EST 1998 | Ron Costa
| | Hello everyone! | | Does any know anything about bare board size variations? | | Is there a spec. or tolerance? | | I'm running small lots of boards and during the screen printing process | | I find that I cannot paste each board perfectly.I've t
Electronics Forum | Fri Nov 12 13:07:45 EST 2010 | G8reflow
Hi, The focal point of my research has been to recommend a reflow oven and develop a process for a small to low-medium production SMT soldering with the following considerations. - Lead-Free - Low to low-medium production - Forced Convection reflow
