Electronics Forum | Mon May 23 10:03:20 EDT 2005 | davef
Spartan IIe are manufactured by xilinx [ http://www.xilinx.com ]. Contact them for suggestions.
Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto
We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top
Electronics Forum | Fri Mar 16 17:09:30 EDT 2007 | davef
Actel, IBM, AMD, Xilinx, Aeroflex, maybe more ...
Electronics Forum | Wed Jan 17 20:08:23 EST 2001 | John Dwinell
Hello All, I am looking for any insight RE: reworking the Xilinx 4044XL 40x40 BGA chip. A customer of mine has no trouble removing it, however, when installing with their BGA rework station, the corner solderballs consistently collapse. Has anyone
Electronics Forum | Wed May 25 22:36:17 EDT 2005 | KEN
...just placed 100 xilinx 1681. These have the integrated heat sinks and bubba these need a lot of heat. You end up with 0402's on the very end of the board that get very hot (225-230) just so you can get the xilinx up to 215C at the balls.
Electronics Forum | Mon May 16 15:29:53 EDT 2005 | jdumont
We have the exact same issue with out 456 ball Xilinx parts. The corner balls either do not touch or are so stretched out that they are intermittant. I believe this to be a moisture ingress problem. Ive been setting up our little batch oven this afte
Electronics Forum | Mon May 16 15:53:17 EDT 2005 | adrian_nishimoto
This has been a problem with new components coming directly from vacuum sealed desiccant packed moisture barrier bags with moisture level cards. We have also baked all boards prior to the BGA rework to ensure no moisture issues were addressed.
Electronics Forum | Tue May 17 10:01:42 EDT 2005 | russ
I have had the same problem with this supplier, we found that one mfg. place or process used a .015" piece of FR4 as the base while others had .030" Fr4, We discontinued use of the .015" and never had a problem again.
Electronics Forum | Fri Jul 08 18:48:50 EDT 2005 | mdang
Hi, We are a Contract Manufacturing and have a project which has a few Xilinx BGA on top and bottom side. Does anyone run a cross this or have any suggestion on how to reflow them. Thank you, -Michael
Electronics Forum | Mon Oct 03 10:20:43 EDT 2005 | davef
Follow your component supplier recommendations. For instance: Xilinx says their lead-free alloy for their BGA spheres is SnAgCu, and liquidous is 217*C and they want you to peak at 230 - 235*C for good wetting according to their reflow guidelines.
