Electronics Forum | Thu Jul 02 16:01:57 EDT 2009 | ewchong
thanks kpm. agree the cause of those pads lifting. all of them were no connects so they cannot be the cause of the electrical failure. when the bga was removed, all the solder balls on the pcb turned into conical shape due to the separation, except
Electronics Forum | Tue Feb 09 17:11:14 EST 2016 | vaghelarajeshh
I have pad lift issue during the rework on Motorola box DSR600 which has the fault of No log and No boot. Pad lifting pattern is on four corners. I have checked the temeprature difference between the corners which is sam as center. I have attache
Electronics Forum | Wed Feb 10 08:37:31 EST 2016 | davef
bga hosed by physics ... to find some older threads on the topic BGA Bowing on the corners. - SMTnet [http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&Thread_ID=6405 ] www.smtnet.com › Electronics Forum • Aug 22, 2003 - 5 posts - 1 au
Electronics Forum | Tue May 17 08:00:26 EDT 2005 | Bob R.
We went through this with one PBGA supplier recently and they were able to get the problem under control by fixing some of their molding processes that were inducing residual stresses. You can really see it in a thermal moire where you measure warpa
Electronics Forum | Thu Sep 15 09:31:02 EDT 2016 | ladmo1
While removing one part, another part - BGA part - several components away, actually melted on one corner - you can see the plastic body of the part oozing out around one corner between the solder balls. Several of the solder balls on the one corner
Electronics Forum | Thu Aug 16 09:42:15 EDT 2007 | russ
This could be the reason for the mask defined pad. ERROR in docs! This happens a lot. I believe this to be case honestly, I would not use mask defined pads for these. If you get a registration shift in mask which is likely you will run into troub
Electronics Forum | Mon Jul 23 05:40:58 EDT 2012 | franks
We are having a problem with a 601 pin BGA in that the corners of the BGA are lifting and taking the pads with them. Faults are not always seen straight away so we are not sure at which point the fault is happening. So far it looks as though flexing
Electronics Forum | Mon Nov 19 05:16:02 EST 2012 | ericrr
Thank you ENIAC for your comments Here is another problem (JUKI KE-750L) Which applies to 0603 (1608 metric) resistors and only resistors (mind you the board is more heavily populated with resistors) After the panel has gone through the oven, Wh
Electronics Forum | Wed Dec 23 11:11:07 EST 1998 | john watt
| | I have been developing a BGA Process and are having problems with a 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the strange thing is that it d
Electronics Forum | Mon Nov 06 10:29:28 EST 2000 | Dean Stadem
All of the replies have merit. Here is another one. Because the cause of the tombstoning is wetting forces that are imbalanced, and one end wets faster or more readily than the other, the 0402 lifts up on that end easily because of its low mass. Incr
