Electronics Forum | Thu Jul 01 00:51:56 EDT 1999 | Scott Cook
| Steve, | | First of all I don't disagree with you, but 104 caps perform a power smoothing function not a data signal function. | | A PCB will still function despite a few dead cap locations. | | It won't function without certain IC lead contact
Electronics Forum | Tue Apr 03 00:55:34 EDT 2001 | philipreyes
Hello Billy!! IPC 7095 covers all the design rules and guide lines in BGA assembly and inspection, this will help you a lot in your problem...But based on your problem, it seems that all the balls were disappeared, try to check the capability of
Electronics Forum | Wed Jan 19 00:42:09 EST 2000 | park kyung sam
In my case, when i solderd the bga in normal reflow(convection hot air). There is a lot of boid. i had tried to reduce void long time. so i reduced just a little. It did't satisfied me but now i cannot looking for the void in soldered bga i
Electronics Forum | Tue Jul 07 03:34:06 EDT 1998 | Martin Kelly
Hi just to let you know, in case you don't, but an x-ray machine is needed too check the solder balls, once they've been placed. See you later, | | I am very interesting of getting information about the criteria inspection of BGA. Example, what are
Electronics Forum | Fri Aug 10 15:30:38 EDT 2001 | davef
More and more pople are seeing voids in solder connections other than BGA balls than ever before. Thats because they never looked [never had the means to look] before. Now, they can't stand it and, like that zit that their mother told them not to m
Electronics Forum | Mon Oct 22 17:47:47 EDT 2001 | davef
We on SMTnet have danced around this component package, but there is not a "background" of knowledge in the fine SMTnet Archives. We in our company use this component package, but have not seen the problems you discuss. [We see other problems.] Th
Electronics Forum | Thu Nov 25 08:23:15 EST 2004 | davef
See, you never should have purchased that xray machine. Look at the mess you've got yourself into now. ;-) Enough recrimination. What you're seeing is not surprising, not that that makes it correct. If you're seeing voids something is wrong with
Electronics Forum | Wed Jan 03 10:34:18 EST 2007 | dphilbrick
Your failure rate should be as good or better than any other leaded part on your board. Have you done a reflow profile on this board. We typically sacrifice a board and drill a hole from the bottom and then imbed a probe under the part to get the tem
Electronics Forum | Fri Jan 07 03:34:12 EST 2011 | rpatel28364
Hi Smarts We are having difficulty in reflowing BGA wiht ROHS process on double sided board. We have tried profiling un populated board and profile is meeting upper spec of solder paste. but our customer is saying they have to heat up BGA and board s
Electronics Forum | Mon Aug 31 14:45:37 EDT 2020 | SMTA-64387994
Can anyone provide any insight to an appropriate way to apply a Gage R&R study to an x-ray inspection machine? We have a Vitrox V810 S2EX machine that we would like to perform a measurement system analysis on. What methods do you use? Which type of G
