Electronics Forum | Thu Aug 12 22:31:10 EDT 1999 | Dave F
| Hello, | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | B.Regards, | Felix | Felix: There are some 30 variables that affect SMT solder qua
Electronics Forum | Tue Jun 05 20:25:27 EDT 2001 | davef
Sorry that I'm so late responding. Your new additon probably has 'backee stains on the floor already. Assuming we're talking about a fairly standard board assembly area, you don't need to specify air quality. 1 We specify * Particulate: Level to b
Electronics Forum | Wed Jun 03 13:50:32 EDT 1998 | Chrys
| Can anyone tell me if there is a reference for smt component height specs on the bottom side of a board, which will also go through wave soldering. A current design I am reviewing has tant caps(7343) and a crystal on the back side. Should I only b
Electronics Forum | Wed Nov 17 15:04:27 EST 2004 | russ
SMT assembly, First, you must utilize paste otherwise the parts will not stay put. Do you have any leaded devices such as QFPs or SOICs? Dispensing paste by hand is very difficult and time consuming for these types of parts. You can either dispense
Electronics Forum | Thu Dec 07 18:13:13 EST 2006 | russ
Just had anopther thought, what type of parts are you using on this board? You may want to try a thin stencil like 5 mil or so this may help you. also can this "tilt" be from a movement during reflow? Russ
Electronics Forum | Fri Dec 08 16:54:42 EST 2006 | flipit
My experience with SMT LED packages is that certain LED package styles tend to float. This floating is caused because the LED is often only terminated on the bottom side of the LED package. Sometimes the LEDs are terminated like a SMT resistor with
Electronics Forum | Thu Dec 07 14:28:25 EST 2006 | russ
Bad design if you have to have a perfect 1206 part. you will always have a lift of some sort when reflow soldering. Solder is 3 dimensional, therefore you cannot get any underneath component, thus eliminating the automated SMT process. Cannot glue
Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas
Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi
Electronics Forum | Sat Jan 15 21:52:15 EST 2000 | Dave Bartlett
I am looking for information comparing the reliability of smt boards vs thru hole boards. Also, information on when to use thru hole instead of smt if there is such a case. Background - We currently make temperature controller with a mix or smt and
Electronics Forum | Fri Jun 18 15:04:19 EDT 1999 | Scott Cook
| Scott, | | I do hurt easy. Be gentle, at least that's what I tell all the women in my life though quickly diminishing supply - oops. I do not happen to believe this statement. I have seen you dodge many a penned "dart" on this very forum. Since I
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