Electronics Forum | Fri Nov 10 17:44:48 EST 2000 | Dave F
In response to your questions: Is the embrittlement from excess gold in lead / tin solder connections bad? It can be vereeee bad. Does it affect all plating processes the same? Give us a break and read the SMTnet Archives, for instance: BGA prob
Electronics Forum | Wed Jan 12 20:18:14 EST 2011 | Jacki
How many % were affected? If a few,it can be caused bcoz of PCB coating. We had encountered it and PCB house replaced for faulty boards. Since then, we do test first if we hve to solder PCBs from this PCB house.
Electronics Forum | Fri Aug 17 08:37:47 EDT 2001 | jbieber
Gregory, I think that the profile is too radical, i.e. zone 6 to zone 7 temperatures are too far apart. I would guess that the solderjoints have not all reached 183C in zone 6 which is why the uBGA's do not have a symmetrical ball collapse. You may
Electronics Forum | Mon Jun 10 10:23:47 EDT 2019 | don_julio
We started getting better reflow after rotating the pcb to locate the greater mass closer to the center of the oven. However we still leave space between panels on the conveyor to achieve a better reflow. This costs us production time. I'm simply lo
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Fri May 11 15:43:41 EDT 2001 | davef
More information would be helpful. For instance: * Talk about the distribution of the problem, including a single lot or from various lots and over components and component types on the board * Tell us about the board (ie, thickness, type, solder ma
Electronics Forum | Wed Apr 23 15:17:11 EDT 2003 | Robert
Let me see if I got this right. The OSP in un-plugged vias will break down after subsequent reflows and washes which can result in oxidation. Question: Is there any paper covering oxidation and reliability on such a condition. We are averaging .0007
Electronics Forum | Mon Jun 13 09:25:58 EDT 2011 | milroy
Hi I have seen some of our multilayer PCBs are having delamination issues even after baking them in the ovens. Does anybody faced this issue before? The problem occured after reflow process and wave solder process as well. The temp profiles are well
Electronics Forum | Tue May 19 12:29:59 EDT 1998 | Richard Jackson
| Richard, | You may be encountering solder paste contamination | on the assembly during the printing process. Solder | will reflow on tin/lead plated lands therefore invisible. | If you are washing the assembly prior to inspection | then you are
Electronics Forum | Mon May 18 22:15:20 EDT 1998 | Steve Gregory
Howdy Richard, Welcome to the club! I now dub thee a full fledged member of the "Spotty Gold Finger and Bleeding Ulcer Society"...or SGFBUS for short... (GRIN) I know it's not funny to be in that position, but there's so many different places to pick
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