Electronics Forum: you (Page 3417 of 3796)

Re: silver finishes on pcbs

Electronics Forum | Thu Dec 14 10:14:04 EST 2000 | PeteB

Jacqueline, Asuming you mean immersion silver: Advantages - Very flat finish compared to HASL, more easily solderable than bare copper with OSP and more process tolerant than this in our experience, reasonable shelf life, cheaper than immersion gol

Re: Quantity of dross and type of flux

Electronics Forum | Tue Nov 21 22:15:59 EST 2000 | Vince Whipple

Mohammed, The first suggested place to start with your question would probably be with your flux Mfr. Push them! The quantity of dross is effected by several factors: The higher your solder pot temp., the higher your dross level... but don't go too

Your next plant

Electronics Forum | Mon Nov 06 12:01:47 EST 2000 | Chad Pawlak

Late last week 10% of the population of Thorp, WI lost their employment. Saputo Cheese of Montreal Canada, formerly Stella Foods and formerly Blue Moon Cheese announced it will shut the doors to this 70 year tradition on Jan 3. Leaving in its wak

Re: Capability Study for Solder Printing Process

Electronics Forum | Wed Sep 20 19:34:13 EDT 2000 | Dave F

Congrats. You now control the source of almost 70% of the defects of your SMT operation. There is a neat series of presentations on printing, each year at SMI. One of the best of the SMI series was in 1997, because presenters used a common board

Re: Barcoding Component Reels

Electronics Forum | Wed Nov 01 12:10:20 EST 2000 | Jeff

charles, i can appreciate the hand held "reel to reel" scanner as a good solution that is very cost effective. during my smt supervision days we had a number of part loading checks. 1. load plan check, 2. scan check, 3. reel to reel manual check.

Re: double sided reflow

Electronics Forum | Thu Jun 22 12:25:07 EDT 2000 | Boca

Jason, What Chrys said! Don't try to run the bottom cooler, tried it in the mid 80's, don't work and don't want it to work. If one side of a fab is maintained cooler than liquidus and the other side into reflow it would have an easy 40C temp diffe

Re: Soldermask Design Rules

Electronics Forum | Fri Jun 16 06:24:43 EDT 2000 | Wolfgang Busko

Hi Todd, it might be a philosophical question if soldermask between finepitch pads is prefered or not. That should depend on the capabilities of a particular site and their experience. We actually prefer soldermask down to 0,4mm pitch and don�t have

Re: qfp and soic joint Problem

Electronics Forum | Tue Apr 11 20:26:16 EDT 2000 | Dave F

Jeremy: Parts assembler make leads of either Alloy 42 (Invar, whatever) or copper. The solderability of these leads are protected with eutectic or non-eutectic tin/lead solder, palladium or some palladium alloy, or gold. Cuppla things to consider:

Re: ICT Fixtures No-Clean Flux

Electronics Forum | Sat Mar 18 07:22:37 EST 2000 | davef

Cartman: Ah, another "hidden cost" of no-clean. I love no-clean people they're putting themselves out-of-business and they don't even realize it, but at least they're saving money. Enough pontificating, "yes" to all of the above. 1 Yes, no-cleans

CIM systems and Final Assembly

Electronics Forum | Mon Jan 22 15:01:32 EST 2001 | aiscorp

CIM systems for electronics assembly have traditionally considered the PCB only. Final assembly "modules" are often attached to traditional systems to accommodate this common requirement for pre-PCB assembly, mechanical assembly, and final assembly


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