Electronics Forum | Wed Oct 25 12:38:05 EDT 2000 | Phil
Hi there!! You know what your QA is doing is right, coz by measuring the solder paste height can avoid the following defects: 1.Insufficient solder 2.Short solder or bridging 3.Solder balls SPC monitoring for paste height checking is required
Electronics Forum | Tue Mar 28 19:43:49 EDT 2017 | aemery
Simon, Trying to dust off my 400 knowledge here, I can picture the 500 and 1500 better in my head. I think the 400 also has a Z axis amplifier box in the back of the machine. Remove the rear lower door and pull out the big square vacuum box. If it
Electronics Forum | Wed May 29 07:41:33 EDT 2024 | tommy_magyar
We use the same component on many different products, never faced a similar issue. However, things I would check are: - stencil thickness (ideally 125um) - additional Z move on the parts around the relay (as suggested by kumarb) - check the packages
Electronics Forum | Thu Oct 21 04:21:55 EDT 2004 | siverts
Have been through this before and we resolved our problem as follows: 1.Make sure that the length of your board support pins on Your HSP is correct. On that machine the board support pins depends on the board thickness (+ - some tenth's of a mm). It'
Electronics Forum | Tue Jul 19 05:16:34 EDT 2005 | aj
Hi, I looked at the pictures and it looks as if it should be a straight forward solution..but obviously not. I would focus on the stencil/print more than placement machine. The placement machine simply places the part on the board!#(just one thing
Electronics Forum | Thu Jun 03 17:24:03 EDT 1999 | Steve A
| Hi everybody, | | Somebody know the advantages of electroformed stencils on laser cut stencils ? | | any coment is apreciated. | | | thanks | | Al | Hey Al, An Electroformed (an additive process) stencil is comparable quality wise as a laser
Electronics Forum | Tue Jun 01 10:11:00 EDT 2004 | davef
Intermetallic growth is a diffusion process, the thickness of the intermetallic is given by: z^2 = (Do)(t)exp[-Q/RT] Where Do (m2 s-1) is the diffusion coefficient, T(�K) is the temperature, Q (J mol-1) is the activation energy and R (8.314 J mo
Electronics Forum | Tue Feb 22 12:02:11 EST 2005 | siverts
The first thing to do, as always with any trouble shooting, is to try to isolate your problem area, then it is much easier to pinpoint and find a solution for the problem. Some simple checks you can do, besides the good suggestions you got from some
Electronics Forum | Tue Nov 15 14:01:00 EST 2011 | olddog
Well, everything WAS going OK until I started setting up for a board job (40 boards with about 450 components each - many image repeats). We setup 37 feeders with their parts and started defining the pickups and placements. Part #1 is an SOD123 zener
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
.gif)
.gif)
