Electronics Forum | Fri Jun 07 07:54:31 EDT 2002 | Hussman69
Wow, slow down guys. The Cyber Sentry (with an S - sorry) is a machine designed to just measure solder paste height, volume, etc. The first models used a laser, but the newer models are a little more sophisticated than that. They have tabletop ver
Electronics Forum | Thu Jul 12 21:58:10 EDT 2007 | davef
Bill 1 Systems for BGA, Flip Chip, CSP and Bump measurement are: * UBM [550 Weddell Dr, Suite 3, Sunnyvale, CA 94089; 800-731-1220 f408-541-0153 contact@ubmusa.com ubmusa.com] ScanView, AutoScan and LaserScan. * Integrated Packaging Assembly; 2221 Ol
Electronics Forum | Mon Aug 10 22:18:02 EDT 1998 | Steve Gregory
I am trying to get an idea of what system seems to work best for >solder paste inspection. I am looking for basic table top >models with he capabilites of height and width measurements. >Can anyone give me suggestions, pricing and why you prefer on
Electronics Forum | Fri Sep 10 11:45:09 EDT 1999 | Scott S. Snider
| scott. | I appreciate your sincere answer. | would tell me the hint about printer if i's possible | To tune our smt process we have to know what is the major X's | for defect. To know major X's with DOE we need a good measurement equipment.
Electronics Forum | Fri Jul 06 03:23:01 EDT 2001 | kennyhktan
Hi there Steven ! Please allow me to share some of my problem we're facing here with you. Here are a few points that I suggest you should check on your current process:- (1)PCB - Component land partern design ? It is per IPC spec ? - Mask
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