Electronics Forum | Tue Oct 12 05:09:13 EDT 1999 | Brian
| | | | | | | Can anyone tell me the formula/method to determine | | | | | | | the amount of weight that solder's surface tension can support. | | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | | of a board during
Electronics Forum | Mon Oct 11 12:49:11 EDT 1999 | John Thorup
| | | | | | Can anyone tell me the formula/method to determine | | | | | | the amount of weight that solder's surface tension can support. | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | of a board during a top s
Electronics Forum | Sat Oct 09 04:17:21 EDT 1999 | Brian
| Can anyone tell me the formula/method to determine | the amount of weight that solder's surface tension can support. | (ie: Maximum weight of components soldered onto a bottom side | of a board during a top side reflow on a Paste/Paste process). |
Electronics Forum | Sat Oct 09 07:33:23 EDT 1999 | Dave F
| | Can anyone tell me the formula/method to determine | | the amount of weight that solder's surface tension can support. | | (ie: Maximum weight of components soldered onto a bottom side | | of a board during a top side reflow on a Paste/Paste proc
Electronics Forum | Sat Oct 09 09:18:21 EDT 1999 | Dave F
| | | | Can anyone tell me the formula/method to determine | | | | the amount of weight that solder's surface tension can support. | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | of a board during a top side reflow on a
Electronics Forum | Sat Oct 09 09:07:48 EDT 1999 | Brian
| | | Can anyone tell me the formula/method to determine | | | the amount of weight that solder's surface tension can support. | | | (ie: Maximum weight of components soldered onto a bottom side | | | of a board during a top side reflow on a Paste/Pa
Electronics Forum | Sat Oct 09 10:30:24 EDT 1999 | bix
| | | | | Can anyone tell me the formula/method to determine | | | | | the amount of weight that solder's surface tension can support. | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | of a board during a top side refl
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef
Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u
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