Electronics Forum | Wed Mar 23 05:17:23 EDT 2011 | arwankhoiruddin
Hi All. I want to know what is the IPC/JEDEC standard for solder paste printing defects. From the brochures of SPI Machines, the recognized defects are excessive, insufficient, misalignment, no solder, bridging, and solder shape error. What document
Electronics Forum | Fri Mar 25 14:33:26 EDT 2011 | davef
IPC-7525 Stencil Design Guidelines
Electronics Forum | Fri Mar 25 06:03:40 EDT 2011 | arwankhoiruddin
Thank you for the reply, Davef. I am thinking if I can get the standard rather than "trial and error". If there is no such standard, is there any experience of what is the range for good and acceptable solder paste (e.g. minimum and maximum percenta
Electronics Forum | Wed Mar 23 11:08:36 EDT 2011 | davef
There is no such standard, nor should there be. The important thing is to make good solder connections. That's IPC standardization focus, defining good results of manufacturing process. The approach that you take in developing the process of making g
Electronics Forum | Sat Sep 14 12:24:44 EDT 2002 | scottefiske
We need to remember here that as printer manufacturers were enhancing their product lines, miniaturization was quickly being developed in the background. In the last 2 years I was involved in developing and conducting a D.O.E./F.M.E.A in determining
Electronics Forum | Sun Sep 15 15:08:00 EDT 2002 | jersbo
My 2 cents... Screen printing may very well have a leg up on deciding SMT defects... however if you pay attention to your stencil (aperture size ratio etc..) and inspect your prints... I believe its a much lesser number... (paste MFG also plays a ro
Electronics Forum | Fri Sep 13 13:51:38 EDT 2002 | kenbliss
I recently saw an ad in a major trade magazine that stated: �about 60%of all printed circuit board manufacturing defects are due to stencil printing� I would like to hear comments from people that are running SMT lines, is this fact and if it is, w
Electronics Forum | Wed Aug 01 08:58:02 EDT 2018 | 2219576
Please check the solder paste height near PCB edges, Please check board clamping during solder paste printing. Please check tooling support boards must be fixed during the printing process. try to set wiper cleaning frequency and fine tune for best
Electronics Forum | Thu Mar 20 20:57:44 EDT 2008 | rrpowers
Well, we are in fact doing a no-clean, multi-shift, very high volume, minimal changeover operation. We use up any paste long before it gets old. Because of the sheer volume any reduction in paste scrap for us is big money. We also are in a zero de
Electronics Forum | Fri Jul 27 13:51:53 EDT 2018 | vlad_saviuk
Hi, have some question: during solder paste printing I'm faced with problems on the edge of the PCB - solder balls on gold pads. During analisys we checked everything - change squeegee preasure, different cleaning cycles, squeegee speed - no effect.
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