Electronics Forum | Thu Jul 31 08:02:16 EDT 2014 | philc
Our company occasionally has the need to rework BGA's, and we currently do this a rather long-winded way, using the stencil to paste the BGA, and then placing by hand. Sometimes we have to use an IR machine to re-flow the part, and at other times, we
Electronics Forum | Thu Aug 05 12:16:15 EDT 2021 | cyber_wolf
Exposure Controls: 8.9 HF Engineering Controls: Use only with production equipment (such as stencil printers and re-flow furnaces) with adequate exhaust ventilation and other safety features specifically designed for use with solder paste. Contro
Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef
National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun
Electronics Forum | Mon Jul 12 12:28:10 EDT 1999 | Wolfgang Busko
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
Electronics Forum | Mon Jul 12 12:39:39 EDT 1999 | M Cox
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
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