Electronics Forum | Thu Jul 27 16:54:46 EDT 2006 | pjc
In-Circuit test, or ICT, is the most common method of electrical test for an assembled PCB. It is the most comprehensive and accurate method to ensure that both the PWB and components are working to specification. Not all components however can be el
Electronics Forum | Tue Mar 07 08:48:55 EST 2006 | samir
Our ICT Guy here at my company loves to use lots of via holes as test points - via holes which are 0.040" diameter, and spaced at 0.004" edge to edge spacing! He doesn't like to tent the via's either, so I always battle via-to-via shorts at the wave
Electronics Forum | Mon Aug 24 18:34:31 EDT 1998 | Steve Evers
| Any competition for Teradyne on this front? Any users out there with comments? | Thanks in advance. | G If your new to the world of Fying Probe ICT you may think this is a new developement. Its not, this technology has been around for 10+ years. M
Electronics Forum | Fri Nov 18 12:35:15 EST 2011 | rway
As the article eludes to, you still need probe access to measure the pins with TestJet. One thing I wanted to add was the use of JTAG for use with Boundary Scan. Certain devices have JTAG capability, but not all JTAG devices are Boundary Scan compa
Electronics Forum | Fri Jun 15 09:59:29 EDT 2001 | brownsj
We have recently had an incident where we feel that we have received a batch of cards from our assembly house which have by-passed their ICT operation. This has been determined by the lack of any indentations on the test pads from the sprung probes.
Electronics Forum | Mon Aug 24 14:57:06 EDT 1998 | Dana Wentworth
| Any competition for Teradyne on this front? Any users out there with comments? | Thanks in advance. | G If you would like to check-out a Teradyne ESI-1004, I have one in my San Jose demo-center that is powered up. Dana Wentworth VP Operations, Com
Electronics Forum | Tue May 09 18:00:33 EDT 2006 | russ
in all actuality, you are both right. Alpha metals does have the toughest/hardest noclean residue that I have seen. When changing to no-clean FLUX you should run different probes. So back to square one. You're both right so who's gonna win?
Electronics Forum | Wed Jan 24 10:20:39 EST 2007 | electronhose
Seriously, OSP?, change the board finish, you are the OEM, correct? You have the power! Also, as another poster mentioned, high force applied at ICT ( possibily to cut through the OSP goop ?!? ) could be warping the board enough to crack the joints.
Electronics Forum | Fri Mar 29 00:18:05 EDT 2019 | SMTA-Vikram
3% NDF. We using 8oz 90 degree blade type razor probes, still same issue. Is there stencil we can use or selective pasting test via so flux will not build in testvia. any help or guidance will be appreciate.
Electronics Forum | Thu Apr 11 00:54:49 EDT 2019 | SMTA-Vikram
Yes, we have try different Flux, probes. etc... also not to paste vs Paste Via, but still we have ~3% NDF due to contact issue. I am looking for selective pasting with less flux dispenser.Any idea or anyone has used? What about plug via before pas
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