Electronics Forum | Tue Apr 27 15:09:48 EDT 2004 | zymet
Hello Ron, Successful removal of an underfilled BGA requires the use of a reworkable underfill, which Zymet manufactures. For more information on such products, send an inquiry to info@zymet.com. Regards, Carol
Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo
There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p
Electronics Forum | Fri Mar 19 10:27:42 EDT 2010 | karlo
No clean pastes leave more flux residues. These can result in void formation and inhibtion of underfill curing. Selection of an underfill that is compatible with the flux residue is important. One company that has written about the effect of flux
Electronics Forum | Wed Nov 24 13:36:48 EST 2010 | diamondmt
I would suggest Zymet CN-1703 for staking of the components using this coating material we use it very extensively with Humiseal 1B31, if you would like; I would be happy to coat a couple of your samples for your evaluation.
Electronics Forum | Tue Nov 30 15:40:09 EST 2010 | diamondmt
Thanks for your reply sir... > > Please tell me, > materials you have suggested are reworkable or > not...? Yes, The material is reworkable, go you Zymet's website you will find all the information located there.
Electronics Forum | Mon Mar 29 14:29:50 EST 2004 | davef
Few people underfill PBGA. People underfill CCGA, uBGA, and FC. Consider a reworkable underfill on those devices that you expect to rework. Reworkable underfill candidates * Thermoset: ME526 (Red) * Loctite: 3567 (Cream) * Dexter: FP 4511 (Black)
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