Partner Websites: 0.2 (Page 3 of 36)

Auswahlhilfe für Wärmeleitpasten | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/efd/resource-center/thermal-compound-selection-guide

Wärmekopplung effizienter ist.   TECHNISCHE DATEN FORMEL 52022 52050 52054 52055 52060 52160 52070 53053 52034 52130 Spezifisches Gewicht bei 25 °C 2.7 2.6 3.0 2.8 2.8 2.6 3.0 2.8 2.8 3.7 Entlüftung: 24 Stunden, % Gewicht 0.1 0.01 0.0 0.0 0.3 0.3 0.3 <0.1 0.2 0.2

ASYMTEK Products | Nordson Electronics Solutions

Nordson_EFD_Thermal_Compound_Selector_Guide.pdf

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/-/media/Files/Nordson/efd/Products/Data-Sheets/Thermal-Compound/Nordson_EFD_Thermal_Compound_Selector_Guide.pdf?la=en

° C 2.7 2.6 3.0 2.8 2.8 2.6 3.0 2.8 2.8 3.7 Bleed: 24 Hrs., % Weight 0.1 0.01 0.0 0.0 0.3 0.3 0.3 <0.1 0.2 0.2 Evaporation: 150C, 24 Hrs., % Weight 0.15 0.6 <2.0 1.0 0.5 0.5 0.2 0.4 0.2 0.3 Thermal Conductivity

ASYMTEK Products | Nordson Electronics Solutions

Příručka pro výběr tepelně vodivé směsi | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/cs-CZ/divisions/efd/resource-center/thermal-compound-selection-guide

Specifická gravitace při 25° C 2.7 2.6 3.0 2.8 2.8 2.6 3.0 2.8 2.8 3.7 Tekutost: 24 hodin, % hmotnosti 0.1 0.01 0.0 0.0 0.3 0.3 0.3 <0.1 0.2 0.2 Vypařování: 150C, 24 hodin, % hmotnosti 0.15 0.6 <2.0 1.0 0.5 0.5 0.2 0.4 0.2 0.3 Tepelná vodivost: W / m-K 0.92 3.8 1.3 1.3 6 2 8.2 3.5 5 1.5 Dielektrická pevnost: V / mil 305 351 265 265 --- --- --- 318 --- 353

ASYMTEK Products | Nordson Electronics Solutions

Руководство по выбору термопасты | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/ru-RU/divisions/efd/resource-center/thermal-compound-selection-guide

Удельный вес при 25 °C 2.7 2.6 3.0 2.8 2.8 2.6 3.0 2.8 2.8 3.7 Выпуск воздуха: 24 часа, вес % 0.1 0.01 0.0 0.0 0.3 0.3 0.3 <0.1 0.2 0.2 Испарение: 150 °C, 24 часа, вес % 0.15 0.6 <2.0 1.0 0.5 0.5 0.2 0.4 0.2 0.3 Теплопроводность: Вт/м К 0.92 3.8 1.3 1.3 6 2

ASYMTEK Products | Nordson Electronics Solutions

Przewodnik po asortymencie składników termoprzewodzących | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/pl-PL/divisions/efd/resource-center/thermal-compound-selection-guide

.   DANE TECHNICZNE FORMUŁA 52022 52050 52054 52055 52060 52160 52070 53053 52034 52130 Ciężar właściwy przy 25°C 2.7 2.6 3.0 2.8 2.8 2.6 3.0 2.8 2.8 3.7 Odprowadzanie: 24 godz., % masy 0.1 0.01 0.0 0.0 0.3 0.3 0.3 <0.1 0.2 0.2 Odparowywanie: 150C, 24 godz

ASYMTEK Products | Nordson Electronics Solutions

Guia de seleção de compostos térmicos | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/pt-BR/divisions/efd/resource-center/thermal-compound-selection-guide

específica a 25 °C 2.7 2.6 3.0 2.8 2.8 2.6 3.0 2.8 2.8 3.7 Sangria: 24 horas, % do peso 0.1 0.01 0.0 0.0 0.3 0.3 0.3 <0.1 0.2 0.2 Evaporação: 150 C, 24 horas, % do peso 0.15 0.6 <2.0 1.0 0.5 0.5 0.2 0.4 0.2 0.3 Condutividade térmica: W/m-K 0.92 3.8 1.3 1.3 6 2 8.2 3.5 5 1.5 Rigidez dielétrica: V/mil 305 351 265 265 n/d n/d n/d 318 n/d 353 Constante

ASYMTEK Products | Nordson Electronics Solutions

Guida alla selezione dei composti termici | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/it-IT/divisions/efd/resource-center/thermal-compound-selection-guide

° C 2.7 2.6 3.0 2.8 2.8 2.6 3.0 2.8 2.8 3.7 Sfiato: 24 ore, % peso 0.1 0.01 0.0 0.0 0.3 0.3 0.3 <0.1 0.2 0.2 Evaporazione: 150C, 24 ore, % peso 0.15 0.6 <2.0 1.0 0.5 0.5 0.2 0.4 0.2 0.3 Conduttività termica: W/m-K 0.92 3.8 1.3 1.3 6 2 8.2 3.5 5 1.5 Resistenza dielettrica

ASYMTEK Products | Nordson Electronics Solutions

Semi-auto SMT Solder Paste Stencil Printer from China manufacturer - Dongguan Intercontinental Techn

| https://www.smtfactory.com/P3-Semi-auto-SMT-Solder-Paste-Stencil-Printer-pd47448364.html

+/- 0.05mm PCB Size 300 x 350 mm 600 x 350 mm 1200 x 350 mm Platform size 300 x 350 mm 700 x 400 mm 1350 x 400 mm Stencil Size(mm) 370*470,550*650 370*470,550*650 370*470,550*650,1500*650 PCB Thickness 0.2 - 6 mm 0.2 - 6 mm 0.2 - 6 mm Stencil Positioning Manual Manual Manual Cycle Time

Guía de selección de compuestos térmicos | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/es-ES/divisions/efd/resource-center/thermal-compound-selection-guide

específica a 25 °C 2.7 2.6 3.0 2.8 2.8 2.6 3.0 2.8 2.8 3.7 Sangrado: 24 horas, % de peso 0.1 0.01 0.0 0.0 0.3 0.3 0.3 <0.1 0.2 0.2 Evaporación: 150C, 24 horas, % de peso 0.15 0.6 <2.0 1.0 0.5 0.5 0.2 0.4 0.2 0.3 Conductividad térmica: W/mK 0.92 3.8 1.3 1.3 6 2 8.2 3.5 5 1.5 Fuerza dieléctrica: V/mil 305 351 265 265 n/c n/c n/c 318 n/c 353 Constante

ASYMTEK Products | Nordson Electronics Solutions

Thermal Compound Selection Guide | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/thermal-compound-selection-guide

.   SPECIFICATIONS FORMULA 52022 52050 52054 52055 52060 52160 52070 53053 52034 52130 Specific Gravity at 25° C 2.7 2.6 3.0 2.8 2.8 2.6 3.0 2.8 2.8 3.7 Bleed: 24 Hrs., % Weight 0.1 0.01 0.0 0.0 0.3 0.3 0.3 <0.1 0.2 0.2 Evaporation: 150C, 24 Hrs., % Weight 0.15 0.6 <2.0 1.0 0.5 0.5 0.2 0.4 0.2 0.3 Thermal Conductivity

ASYMTEK Products | Nordson Electronics Solutions


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