Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/angr-2012-gl-5-glue-nozzle-1d1s-0-3-mm-p-0-8-g-0-1-7500-0891-191819?page=77&category=1115&order=list_price+asc
FUJI GL-5 Glue Nozzle 1D1S 0.3 mm, P=0.8 G=0.1 (=7500 0891) ANGR-2012 | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products FUJI GL-5 Glue Nozzle 1D1S 0.3 mm, P=0.8 G=0.1 (=7500 0891
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/angr-2012-gl-5-glue-nozzle-1d1s-0-3-mm-p-0-8-g-0-1-7500-0891-191819?page=77&category=1115&order=list_price+desc
FUJI GL-5 Glue Nozzle 1D1S 0.3 mm, P=0.8 G=0.1 (=7500 0891) ANGR-2012 | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products FUJI GL-5 Glue Nozzle 1D1S 0.3 mm, P=0.8 G=0.1 (=7500 0891
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/angr-2012-gl-5-glue-nozzle-1d1s-0-3-mm-p-0-8-g-0-1-7500-0891-191819?page=9&category=1141&order=name+asc
FUJI GL-5 Glue Nozzle 1D1S 0.3 mm, P=0.8 G=0.1 (=7500 0891) ANGR-2012 | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products SMT Nozzles GL-5 Glue Nozzle 1D1S 0.3 mm, P=0.8 G=0.1 (=7500 0891
Heller Industries Inc. | https://hellerindustries.com/parts/6674k/
6674K - FLOWMETER MM Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
Heller Industries Inc. | https://hellerindustries.com/parts/7176k/
7176K - Shim 20 ID X 28 OD X 0.3 THK Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/qfn-thermal-via-pitch_topic2914.html
. Some app notes I have read recommend a pitch of 1.0 to 1.5 mm Is there an IPC spec for this? I assume there is a way to set the size and number of solder paste squares in Footprint Expert
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/qfn-thermal-via-pitch_topic2914_post11617.html
. When I change the value Thermal Pad Minimum Pattern Space it has no effect on the solder paste pattern. This pattern has a pitch of about 1.85 mm
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/qfn-thermal-via-pitch_topic2914_post11613.html
. When I change the value Thermal Pad Minimum Pattern Space it has no effect on the solder paste pattern. This pattern has a pitch of about 1.85 mm
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2914&OB=ASC.html
. Some app notes I have read recommend a pitch of 1.0 to 1.5 mm Is there an IPC spec for this? I assume there is a way to set the size and number of solder paste squares in Footprint Expert
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/qfn-thermal-via-pitch_topic2914.html
. Some app notes I have read recommend a pitch of 1.0 to 1.5 mm Is there an IPC spec for this? I assume there is a way to set the size and number of solder paste squares in Footprint Expert
