PCB Libraries, Inc. | https://www.pcblibraries.com/forum/proportional-throughhole-padstacks_topic90_post1530.html
0.4mm has a pad size of 1.00mm whilst in the VIA chart, a 0.4mm hole has a pad size of between 0.65mm and 0.8mm. I realise there is no solder fillet required on a via but have been tearing what little there is left of my hair out trying to figure out how the VIA pad is calculated and if it is defined anywhere in IPC
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/proportional-throughhole-padstacks_topic90_post1532.html
. I tried to clarify it with the IPC and got the answer back that the standard does cover vias as well as through-hole pads but other IPC people I've spoken to have thought the opposite
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/proportional-throughhole-padstacks_topic90_post1476.html
. I tried to clarify it with the IPC and got the answer back that the standard does cover vias as well as through-hole pads but other IPC people I've spoken to have thought the opposite
| https://www.eptac.com/wp-content/uploads/2013/06/eptac_06_19_13.pdf
| https://www.eptac.com/wp-content/uploads/eptac/datasheets/EPTAC_DataSheet_IPCDesigner_CID-Plus.pdf
. This 4-day, lectured course delves into design and fabrication issues that go beyond the fundamentals of layout, component placement and routing consideration to understanding fabrication materials
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_IPCDesigner_CID-Plus.pdf
. This 4-day, lectured course (3-days lecture, 1-day review and testing), delves into design and fabrication issues that go beyond the fundamentals of layout, component placement and routing consideration to understanding fabrication materials, testing of not only
| https://www.eptac.com/etrainings/ipc-advanced-designer-certification-online/
. This 4-day, lectured course (3-days lecture, 1-day review and testing), delves into design and fabrication issues that go beyond the fundamentals of layout, component placement and routing consideration to understanding fabrication materials, testing of not only
| http://www.feedersupplier.com/SMT_THROUGH_HOLE
. Thus, both sides of the boards can be easily utilized for mounting, and there is no need for plated drill holes. For the purpose of connecting traces in the circuit layers, one may use vias instead, which are structurally the same as plated through-holes but much smaller
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc7351-padstack-naming-convention_topic36_post3503.html
:1 scale of the land size Inner Layer Land is the same shape as the outer layer land The Primary and Secondary lands are the same size The inner layer land shapes are Circular Vias are Circular Thermal
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc7351-padstack-naming-convention_topic36_post87.html
:1 scale of the land size Inner Layer Land is the same shape as the outer layer land The Primary and Secondary lands are the same size The inner layer land shapes are Circular Vias are Circular Thermal
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