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board pad from oxidizing in the welding, It plays a significant improving effect to improve the weldability of lead-free solder. With the improvement of the packing density and fine pitch (Fine pitch) assembly technologies ,the nitrogen reflow process
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lead-free solder. With the improvement of the packing density and fine pitch (Fine pitch) assembly technologies ,the nitrogen reflow process and equipment improve the quality and yield of the reflow soldering. Nitrogen reflow has become the
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lead-free solder. With the improvement of the packing density and fine pitch (Fine pitch) assembly technologies ,the nitrogen reflow process and equipment improve the quality and yield of the reflow soldering. Nitrogen reflow has become the
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