ASCEN Technology | https://www.ascen.ltd/Products/solder_dross_separator/511.html
: 20 days Desciption: solder dross separator for tin slag/solder dross recycling from the wave solder equipment. A09F model solder dross recycling system total equiped both warm zoon,support large capacity tin slag separation,more efficient and faster
| http://etasmt.com/te_news_industry/2013-03-29/3561.chtml
('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb). Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance. Tin (Sn)-Lead (Pb
| http://etasmt.com:9060/te_news_industry/2013-03-29/3561.chtml
('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb). Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance. Tin (Sn)-Lead (Pb
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/construction-and-architectural?con=t&page=40
102IL selective soldering system features interchangeable tin-lead and lead-free solder pots for batch or in-line production Nordson SELECT to Exhibit Cerno 103IL Selective Soldering Equipment Nordson SELECT Cerno™
| http://www.szhonreal.com/productview.asp?id=37
pieces, the damage Solder defects Tin much, tin tin, even less Wave soldering detection Little tin, tin, and solder bridge or even a short circuit, virtual welding, empty Anti-static measures
ASCEN Technology | https://www.ascen.ltd/Products/solder_dross_separator/509.html
: this small tin slag solder recycling machine and solder dross separation system can according to the size and space of the wave soldering furnace, it can be directly installed in the limited area
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
°C – 220°C183°CMelting Point Lead FreeEutectic (Tin Lead) PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 5 of 24 Rev Level: 1 Rev Date: 1/03/01 Soldering Technology International Investigation
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/leadfree.pdf
°C – 220°C183°CMelting Point Lead FreeEutectic (Tin Lead) PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 5 of 24 Rev Level: 1 Rev Date: 1/03/01 Soldering Technology International Investigation
| http://etasmt.com/cc?ID=te_news_bulletin,23575&url=_print
(from plating) and to the pad (from hot air leveling or other pcb solder-coating method), an intermetallic of tin-copper forms. This is typically Cu6Sn5 or Cu5Sn6 and this intermetallic is what causes the solder to adhere to the copper pads and leads
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_dismantling-skill-of-smt-processing_topic2356.xml
; For components with few pins, such as resistance, capacitance, diode, triode etc., tin on one of the pads on the PCB board, then use the tweezer to hold the component to the mounting position and hold it against the board
