| http://etasmt.com/cc?ID=te_news_bulletin,13161&url=_print
. Controlled tin flow direction; 5. The soldering surface does not move during reflow soldering. 1. Appropriate heat. Appropriate heat means that for the reflow soldering materials, there must be enough thermal energy to melt them and form an intermetallic interface (IMC
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_assembly_forum54.xml
; For components with few pins, such as resistance, capacitance, diode, triode etc., tin on one of the pads on the PCB board, then use the tweezer to hold the component to the mounting position and hold it against the board
| https://www.eptac.com/soldertip/soldertips-dealing-with-the-problems-of-soldering-iron-tips-breaking-down/
quite higher than the melting temperature of the good old 63/37 or 60/40 tin/lead alloy solder. We were wrong. Increasing the solder iron temperature did not help, in fact, it created more problems and tip usage went through the roof
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-dealing-with-the-problems-of-soldering-iron-tips-breaking-down
quite higher than the melting temperature of the good old 63/37 or 60/40 tin/lead alloy solder. We were wrong. Increasing the solder iron temperature did not help, in fact, it created more problems and tip usage went through the roof
Heller Industries Inc. | https://hellerindustries.com/intermetallics-growth/
Intermetallic Growth on PCB - Heller Home » Intermetallic Growth on PCB Re-printed in partnership with ITM Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad
Heller Industries Inc. | https://hellerindustries.com/intermetallic-growth/
Intermetallic Growth on PCB - Heller Home » Intermetallic Growth on PCB Re-printed in partnership with ITM Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead (from plating) and to the pad
ASCEN Technology | https://www.ascen.ltd/optical_inspection/1084.html
> Solder recycling machine and solder dross separator operation solder dross recycling machine tin slag recycle system manual PCB board cutter equipment PCB material cutting machine ASCEN PCB robotic
ASCEN Technology | https://www.ascen.ltd/optical_inspection/1083.html
> Solder recycling machine and solder dross separator operation solder dross recycling machine tin slag recycle system manual PCB board cutter equipment PCB material cutting machine ASCEN PCB robotic
